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M5M4256AP-15

Description
Page Mode DRAM, 256KX1, 150ns, NMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16
Categorystorage    storage   
File Size363KB,9 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
Download Datasheet Parametric Compare View All

M5M4256AP-15 Overview

Page Mode DRAM, 256KX1, 150ns, NMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16

M5M4256AP-15 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Reach Compliance Codeunknown
ECCN codeEAR99
access modePAGE
Maximum access time150 ns
Other featuresRAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O typeSEPARATE
JESD-30 codeR-PDIP-T16
JESD-609 codee0
length19 mm
memory density262144 bit
Memory IC TypePAGE MODE DRAM
memory width1
Number of functions1
Number of ports1
Number of terminals16
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle256
Maximum seat height4.5 mm
Maximum slew rate0.055 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyNMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

M5M4256AP-15 Related Products

M5M4256AP-15 M5M4256AP-85 M5M4256AL-15 M5M4256AJ-85 M5M4256AJ-10 M5M4256AJ-15
Description Page Mode DRAM, 256KX1, 150ns, NMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 Page Mode DRAM, 256KX1, 85ns, NMOS, PDIP16, 0.300 INCH, PLASTIC, DIP-16 Page Mode DRAM, 256KX1, 150ns, NMOS, PZIP16, 0.325 INCH, PLASTIC, ZIP-16 Page Mode DRAM, 256KX1, 85ns, NMOS, PQCC18, PLASTIC, LCC-18 Page Mode DRAM, 256KX1, 100ns, NMOS, PQCC18, PLASTIC, LCC-18 Page Mode DRAM, 256KX1, 150ns, NMOS, PQCC18, PLASTIC, LCC-18
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Mitsubishi Mitsubishi Mitsubishi Mitsubishi Mitsubishi Mitsubishi
Parts packaging code DIP DIP ZIP LCC LCC LCC
package instruction DIP, DIP16,.3 DIP, DIP16,.3 ZIP, ZIP16,.1 QCCJ, LDCC18,.33X.53 QCCJ, LDCC18,.33X.53 QCCJ, LDCC18,.33X.53
Contacts 16 16 16 18 18 18
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode PAGE PAGE PAGE PAGE PAGE PAGE
Maximum access time 150 ns 85 ns 150 ns 85 ns 100 ns 150 ns
Other features RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-PDIP-T16 R-PDIP-T16 R-PZIP-T16 R-PQCC-J18 R-PQCC-J18 R-PQCC-J18
JESD-609 code e0 e0 e0 e0 e0 e0
length 19 mm 19 mm 20.15 mm 12.45 mm 12.45 mm 12.45 mm
memory density 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit 262144 bit
Memory IC Type PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM PAGE MODE DRAM
memory width 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 16 16 16 18 18 18
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX1 256KX1 256KX1 256KX1 256KX1 256KX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP ZIP QCCJ QCCJ QCCJ
Encapsulate equivalent code DIP16,.3 DIP16,.3 ZIP16,.1 LDCC18,.33X.53 LDCC18,.33X.53 LDCC18,.33X.53
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 256 256 256 256 256 256
Maximum seat height 4.5 mm 4.5 mm 8.3 mm 3.5 mm 3.5 mm 3.5 mm
Maximum slew rate 0.055 mA 0.07 mA 0.055 mA 0.07 mA 0.065 mA 0.055 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES YES YES
technology NMOS NMOS NMOS NMOS NMOS NMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND J BEND J BEND
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL ZIG-ZAG QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 7.62 mm 2.8 mm 7.25 mm 7.25 mm 7.25 mm
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