Flash Module, 1MX32, 90ns, SIMM-80
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
Parts packaging code | SIMM |
package instruction | SIMM, |
Contacts | 80 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.1.A |
Maximum access time | 90 ns |
Other features | TTL COMPATIBLE I/O |
JESD-30 code | R-XSMA-N80 |
memory density | 33554432 bit |
Memory IC Type | FLASH MODULE |
memory width | 32 |
Number of functions | 1 |
Number of terminals | 80 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
organize | 1MX32 |
Package body material | UNSPECIFIED |
encapsulated code | SIMM |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Programming voltage | 5 V |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Terminal form | NO LEAD |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
EDI7F341MC90BNC | EDI7F2341MC100BNC | EDI7F2341MC150BNC | EDI7F341MC100BNC | EDI7F341MC120BNC | EDI7F341MC150BNC | EDI7F2341MC120BNC | EDI7F2341MC90BNC | |
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Description | Flash Module, 1MX32, 90ns, SIMM-80 | Flash Module, 2MX32, 100ns, SIMM-80 | Flash Module, 2MX32, 150ns, SIMM-80 | Flash Module, 1MX32, 100ns, SIMM-80 | Flash Module, 1MX32, 120ns, SIMM-80 | Flash Module, 1MX32, 150ns, SIMM-80 | Flash Module, 2MX32, 120ns, SIMM-80 | Flash Module, 2MX32, 90ns, SIMM-80 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
Parts packaging code | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
package instruction | SIMM, | SIMM, | SIMM, | SIMM, | SIMM, | SIMM, | SIMM, | SIMM, |
Contacts | 80 | 80 | 80 | 80 | 80 | 80 | 80 | 80 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
Maximum access time | 90 ns | 100 ns | 150 ns | 100 ns | 120 ns | 150 ns | 120 ns | 90 ns |
JESD-30 code | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 | R-XSMA-N80 |
memory density | 33554432 bit | 67108864 bit | 67108864 bit | 33554432 bit | 33554432 bit | 33554432 bit | 67108864 bit | 67108864 bit |
Memory IC Type | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 80 | 80 | 80 | 80 | 80 | 80 | 80 | 80 |
word count | 1048576 words | 2097152 words | 2097152 words | 1048576 words | 1048576 words | 1048576 words | 2097152 words | 2097152 words |
character code | 1000000 | 2000000 | 2000000 | 1000000 | 1000000 | 1000000 | 2000000 | 2000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
organize | 1MX32 | 2MX32 | 2MX32 | 1MX32 | 1MX32 | 1MX32 | 2MX32 | 2MX32 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Programming voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal location | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |