AM29809PCB datasheet, PDF - EEWORLD Datasheet

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AM29809PCB: DescriptionIdentity Comparator, TTL, PDIP24; Categorylogic logic; File Size423KB，9 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29809PCB Overview

Identity Comparator, TTL, PDIP24

AM29809PCB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	DIP, DIP24,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
Logic integrated circuit type	IDENTITY COMPARATOR
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

AM29809PCB Related Products

	AM29809PCB	AM29806LCB	AM29806PC	AM29806PCB	AM29809LCB	AM29809PC
Description	Identity Comparator, TTL, PDIP24	Identity Comparator, TTL, CQCC28	Identity Comparator, TTL, PDIP24	Identity Comparator, TTL, PDIP24	Identity Comparator, TTL, CQCC28	Identity Comparator, TTL, PDIP24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	AMD	AMD	AMD	AMD	AMD	AMD
package instruction	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3	DIP, DIP24,.3	QCCN, LCC28,.45SQ	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T24	S-XQCC-N28	R-PDIP-T24	R-PDIP-T24	S-XQCC-N28	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	IDENTITY COMPARATOR	IDENTITY COMPARATOR	IDENTITY COMPARATOR	IDENTITY COMPARATOR	IDENTITY COMPARATOR	IDENTITY COMPARATOR
Number of terminals	24	28	24	24	28	24
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	QCCN	DIP	DIP	QCCN	DIP
Encapsulate equivalent code	DIP24,.3	LCC28,.45SQ	DIP24,.3	DIP24,.3	LCC28,.45SQ	DIP24,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
surface mount	NO	YES	NO	NO	YES	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	QUAD	DUAL

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