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AM29806LCB

Description
Identity Comparator, TTL, CQCC28
Categorylogic    logic   
File Size423KB,9 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM29806LCB Overview

Identity Comparator, TTL, CQCC28

AM29806LCB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
package instructionQCCN, LCC28,.45SQ
Reach Compliance Codeunknown
JESD-30 codeS-XQCC-N28
JESD-609 codee0
Logic integrated circuit typeIDENTITY COMPARATOR
Number of terminals28
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC28,.45SQ
Package shapeSQUARE
Package formCHIP CARRIER
surface mountYES
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD

AM29806LCB Related Products

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Description Identity Comparator, TTL, CQCC28 Identity Comparator, TTL, PDIP24 Identity Comparator, TTL, PDIP24 Identity Comparator, TTL, CQCC28 Identity Comparator, TTL, PDIP24 Identity Comparator, TTL, PDIP24
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker AMD AMD AMD AMD AMD AMD
package instruction QCCN, LCC28,.45SQ DIP, DIP24,.3 DIP, DIP24,.3 QCCN, LCC28,.45SQ DIP, DIP24,.3 DIP, DIP24,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code S-XQCC-N28 R-PDIP-T24 R-PDIP-T24 S-XQCC-N28 R-PDIP-T24 R-PDIP-T24
JESD-609 code e0 e0 e0 e0 e0 e0
Logic integrated circuit type IDENTITY COMPARATOR IDENTITY COMPARATOR IDENTITY COMPARATOR IDENTITY COMPARATOR IDENTITY COMPARATOR IDENTITY COMPARATOR
Number of terminals 28 24 24 28 24 24
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCN DIP DIP QCCN DIP DIP
Encapsulate equivalent code LCC28,.45SQ DIP24,.3 DIP24,.3 LCC28,.45SQ DIP24,.3 DIP24,.3
Package shape SQUARE RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE IN-LINE CHIP CARRIER IN-LINE IN-LINE
surface mount YES NO NO YES NO NO
technology TTL TTL TTL TTL TTL TTL
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location QUAD DUAL DUAL QUAD DUAL DUAL

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