Identity Comparator, TTL, CQCC28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | AMD |
package instruction | QCCN, LCC28,.45SQ |
Reach Compliance Code | unknown |
JESD-30 code | S-XQCC-N28 |
JESD-609 code | e0 |
Logic integrated circuit type | IDENTITY COMPARATOR |
Number of terminals | 28 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | CERAMIC |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC28,.45SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
surface mount | YES |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
AM29806LCB | AM29806PC | AM29806PCB | AM29809LCB | AM29809PC | AM29809PCB | |
---|---|---|---|---|---|---|
Description | Identity Comparator, TTL, CQCC28 | Identity Comparator, TTL, PDIP24 | Identity Comparator, TTL, PDIP24 | Identity Comparator, TTL, CQCC28 | Identity Comparator, TTL, PDIP24 | Identity Comparator, TTL, PDIP24 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | AMD | AMD | AMD | AMD | AMD | AMD |
package instruction | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | S-XQCC-N28 | R-PDIP-T24 | R-PDIP-T24 | S-XQCC-N28 | R-PDIP-T24 | R-PDIP-T24 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR | IDENTITY COMPARATOR |
Number of terminals | 28 | 24 | 24 | 28 | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QCCN | DIP | DIP | QCCN | DIP | DIP |
Encapsulate equivalent code | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | DIP24,.3 |
Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
surface mount | YES | NO | NO | YES | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |