F-208-1
QTH–090–01–C–D–A
®
QTH–030–01–L–D–A–RT1
QTH–060–07–F–D–A
0,50
mm
HI-SPEED HEADER
QTH SERIES
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal
Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au over 50µ" (1,27µm) Ni
Current Rating:
Contact: 1.0A @ 30°C
Temperature Rise
Ground Plane: 7.8A @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5mm Stack Height)
Max Cycles:
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
Mates with:
QSH, HFHM,
HFHM2, HQCD
(See Application
Specific note)
Integral metal plane for
power or ground
(0,50mm)
.0197"
pitch
Retention
Option
®
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Standard
Stack Heights
from 5mm to 25mm
Polarized
5mm Stack Height
Rated @ -3dB Insertion Loss
Single-Ended Signaling
9 GHz / 18 Gbps
Differential Pair Signaling
8 GHz / 16 Gbps
Performance data for other stack heights
available at www.samtec.com?QTH
ALSO AVAILABLE
Differential Pair version.
See QTH-DP Series.
Board Spacing Standoffs.
See SO Series.
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (030-060)
(0,15mm) .006" max (090-120)
Board Stacking:
For applications requiring more
than two connectors per board
or 120 positions or higher,
contact ipg@samtec.com
QTH
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart.
A
(4,27)
.168
(7,26)
.286
(10,27)
.404
(15,25)
.600
(18,24)
.718
(24,24)
.954
PLATING
OPTION
D
A
OTHER
OPTION
–030, –060, –090, –120
(60 total positions per bank)
QTH
LEAD
STYLE
–L
= 10µ" (0,25µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–K
= (7,00mm) .275"
DIA Polyimide film
Pick & Place Pad
APPLICATION
SPECIFIC OPTION
• 14mm, 15mm, 22mm and 30mm
stack height (Caution: Some automatic
placement/inspection machines may
have component height restrictions.
Please consult machinery specifications.)
• 30µ" (0,76µm) Gold (Specify -H plating
for Data Rate cable mating applications.)
• Edge Mount & Guide Posts
• 150 positions per row
Call Samtec.
HEIGHT
WITH QSH
(5,00)
.198
(8,00)
.316
(11,00)
.433
(16,00)
.630
(19,00)
.748
(25,00)
.984
–F
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–TR
= Tape & Reel
(–090 positions
maximum)
–01
–02
–03
–04
–05
–07
–C*
= Electro-Polished Selective
50µ" (1,27µm) min Au over
150µ" (3,81µm) Ni on Signal
Pins in contact area,
10µ" (0,25µm) min Au over
50µ" (1,27µm) Ni on Ground
Plane in contact area,
Matte Tin over 50µ" (1,27µm)
min Ni on all solder tails
–RT1
= Retention Option
(–01 Lead Style
only &
–090 positions
maximum)
01
(No. of Positions per Row/30) x (20,00) .7875
(20,00) .7875
(7,11)
.280
(3,30)
.130
(0,76)
.030
(1,57)
.062
(1,57)
.062
DIA
–RT1
02
(0,50)
.0197
(0,20)
.008
A
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
–01 & –02
–03 thru –07
A
(0,89)
.035
DIA
–01
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