128KX8 NON-VOLATILE SRAM MODULE, 70ns, PDIP32, PLASTIC, MODULE, DIP-32
Parameter Name | Attribute value |
Maker | STMicroelectronics |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 70 ns |
JESD-30 code | R-PDIP-T32 |
length | 42.8 mm |
memory density | 1048576 bit |
Memory IC Type | NON-VOLATILE SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 9.52 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
M48Z129V-70PM1TR | M48Z129Y-85PM1TR | |
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Description | 128KX8 NON-VOLATILE SRAM MODULE, 70ns, PDIP32, PLASTIC, MODULE, DIP-32 | 128KX8 NON-VOLATILE SRAM MODULE, 85ns, PDIP32, PLASTIC, MODULE, DIP-32 |
Maker | STMicroelectronics | STMicroelectronics |
Parts packaging code | DIP | DIP |
package instruction | DIP, | DIP, |
Contacts | 32 | 32 |
Reach Compliance Code | unknown | unknown |
ECCN code | EAR99 | EAR99 |
Maximum access time | 70 ns | 85 ns |
JESD-30 code | R-PDIP-T32 | R-PDIP-T32 |
length | 42.8 mm | 42.8 mm |
memory density | 1048576 bit | 1048576 bit |
Memory IC Type | NON-VOLATILE SRAM MODULE | NON-VOLATILE SRAM MODULE |
memory width | 8 | 8 |
Number of functions | 1 | 1 |
Number of terminals | 32 | 32 |
word count | 131072 words | 131072 words |
character code | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 128KX8 | 128KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 9.52 mm | 9.52 mm |
Maximum supply voltage (Vsup) | 3.6 V | 5.5 V |
Minimum supply voltage (Vsup) | 3 V | 4.5 V |
Nominal supply voltage (Vsup) | 3.3 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
width | 15.24 mm | 15.24 mm |