SRAM Module, 2MX8, 150ns, CMOS, MODULE, SIP-36
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | EDI [Electronic devices inc.] |
| package instruction | MODULE, SIP-36 |
| Reach Compliance Code | unknown |
| Maximum access time | 150 ns |
| I/O type | COMMON |
| JESD-30 code | R-XSMA-T36 |
| JESD-609 code | e0 |
| memory density | 16777216 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 36 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| Encapsulate equivalent code | SIP36 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.02 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.21 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| EDI8F82048C150BSC | EDI8F82048LP150BSC | EDI8F82048C120BSC | EDI8F82048LP120BSC | |
|---|---|---|---|---|
| Description | SRAM Module, 2MX8, 150ns, CMOS, MODULE, SIP-36 | SRAM Module, 2MX8, 150ns, CMOS, MODULE, SIP-36 | SRAM Module, 2MX8, 120ns, CMOS, MODULE, SIP-36 | SRAM Module, 2MX8, 120ns, CMOS, MODULE, SIP-36 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| package instruction | MODULE, SIP-36 | MODULE, SIP-36 | MODULE, SIP-36 | MODULE, SIP-36 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maximum access time | 150 ns | 150 ns | 120 ns | 120 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 | R-XSMA-T36 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 36 | 36 | 36 | 36 |
| word count | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| character code | 2000000 | 2000000 | 2000000 | 2000000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 2MX8 | 2MX8 | 2MX8 | 2MX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Encapsulate equivalent code | SIP36 | SIP36 | SIP36 | SIP36 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.02 A | 0.0003 A | 0.02 A | 0.0003 A |
| Minimum standby current | 4.5 V | 2 V | 4.5 V | 2 V |
| Maximum slew rate | 0.21 mA | 0.21 mA | 0.21 mA | 0.21 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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