DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Parameter Name | Attribute value |
Maker | SAMSUNG |
Parts packaging code | BGA |
package instruction | LBGA, |
Contacts | 165 |
Reach Compliance Code | unknown |
ECCN code | 3A991.B.2.A |
K7I160884B-FC250 | K7I160884B-FC200 | K7I160884B-FC300 | K7I160884B-FC160 | |
---|---|---|---|---|
Description | DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | DDR SRAM, 2MX8, 0.45ns, CMOS, PBGA165, FBGA-165 | DDR SRAM, 2MX8, 0.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 |
Maker | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
package instruction | LBGA, | LBGA, | LBGA, | LBGA, |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Parts packaging code | BGA | BGA | - | BGA |
Contacts | 165 | 165 | - | 165 |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | - | 3A991.B.2.A |
Maximum access time | - | 0.45 ns | 0.45 ns | 0.5 ns |
Other features | - | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
JESD-30 code | - | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B165 |
length | - | 15 mm | 15 mm | 15 mm |
memory density | - | 16777216 bit | 16777216 bit | 16777216 bit |
Memory IC Type | - | DDR SRAM | DDR SRAM | DDR SRAM |
memory width | - | 8 | 8 | 8 |
Number of functions | - | 1 | 1 | 1 |
Number of terminals | - | 165 | 165 | 165 |
word count | - | 2097152 words | 2097152 words | 2097152 words |
character code | - | 2000000 | 2000000 | 2000000 |
Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | - | 70 °C | 70 °C | 70 °C |
organize | - | 2MX8 | 2MX8 | 2MX8 |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | LBGA | LBGA | LBGA |
Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL |
Maximum seat height | - | 1.4 mm | 1.4 mm | 1.4 mm |
Maximum supply voltage (Vsup) | - | 1.9 V | 1.9 V | 1.9 V |
Minimum supply voltage (Vsup) | - | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | - | 1.8 V | 1.8 V | 1.8 V |
surface mount | - | YES | YES | YES |
technology | - | CMOS | CMOS | CMOS |
Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | - | BALL | BALL | BALL |
Terminal pitch | - | 1 mm | 1 mm | 1 mm |
Terminal location | - | BOTTOM | BOTTOM | BOTTOM |
width | - | 13 mm | 13 mm | 13 mm |