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HM6-6617B-9

Description
2KX8 OTPROM, 105ns, CDIP24, SLIM, SIDE BRAZED, DIP-24
Categorystorage    storage   
File Size83KB,7 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

HM6-6617B-9 Overview

2KX8 OTPROM, 105ns, CDIP24, SLIM, SIDE BRAZED, DIP-24

HM6-6617B-9 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRenesas Electronics Corporation
Parts packaging codeDIP
package instructionSLIM, SIDE BRAZED, DIP-24
Contacts24
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time105 ns
JESD-30 codeR-CDIP-T24
JESD-609 codee0
memory density16384 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum standby current0.0001 A
Maximum slew rate0.052 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
TM
HM-6617
2K x 8 CMOS PROM
Description
The HM-6617 is a 16,384 bit fuse link CMOS PROM in a 2K
word by 8-bit/word format with “Three-State” outputs. This
PROM is available in the standard 0.600 inch wide 24 pin
SBDIP, the 0.300 inch wide slimline SBDIP, and the JEDEC
standard 32 pad CLCC.
The HM-6617 utilizes a synchronous design technique. This
includes on-chip address latches and a separate output
enable control which makes this device ideal for applications
utilizing recent generation microprocessors. This design
technique, combined with the Intersil advanced self-aligned
silicon gate CMOS process technology offers ultra-low
standby current. Low ICCSB is ideal for battery applications
or other systems with low power requirements.
The Intersil NiCr fuse link technology is utilized on this and
other Intersil CMOS PROMs. This gives the user a PROM
with permanent, stable storage characteristics over the full
industrial and military temperature voltage ranges. NiCr fuse
technology combined with the low power characteristics of
CMOS provides an excellent alternative to standard bipolar
PROMs or NMOS EPROMs.
All bits are manufactured storing a logical “0” and can be
selectively programmed for a logical “1” at any bit location.
March 1997
Features
• Low Power Standby and Operating Power
- ICCSB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100µA
- ICCOP . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA at 1MHz
Fast Access Time . . . . . . . . . . . . . . . . . . . . . . 90/120ns
Industry Standard Pinout
Single 5.0V Supply
CMOS/TTL Compatible Inputs
High Output Drive . . . . . . . . . . . . . . . . 12 LSTTL Loads
Synchronous Operation
On-Chip Address Latches
Separate Output Enable
Ordering Information
PACKAGE
SBDIP
SMD#
SLIM
SBDIP
SMD#
CLCC
SMD#
TEMP. RANGE
90ns
120ns
PKG.
NO.
D24.6
D24.6
D24.3
D24.3
J32.A
-40
o
C to +85
o
C HM1-6617B- HM1-
9
6617-9
-55
o
C to +125
o
C 5962-
8954002JA
5962-
8954001JA
-40
o
C to +85
o
C HM6-6617B- HM6-
9
6617-9
-55
o
C to +125
o
C 5962-
8954002LA
5962-
8954001LA
-40
o
C to +85
o
C HM4-6617B- HM4-
9
6617-9
5962-
J32.A
-55
o
C to +125
o
C 5962-
8954002XA 8954001XA
Pinouts
HM-6617 (SBDIP)
TOP VIEW
A7
HM-6617 (CLCC)
TOP VIEW
V
CC
NC
NC
NC
NC
NC
PIN DESCRIPTION
PIN
29 A8
28 A9
27 NC
26 P
25 G
24 A10
23 E
22 Q7
21 Q6
DESCRIPTION
No Connect
Address Inputs
Chip Enable
Data Output
Power (+5V)
Output Enable
Output Enable
A7
A6
A5
A4
A3
A2
A1
A0
Q0
1
2
3
4
5
6
7
8
9
24 V
CC
23 A8
22 A9
21 P
20 G
19 A10
18 E
17 Q7
16 Q6
15 Q5
14 Q4
13 Q3
A6 5
A5 6
A4 7
A3 8
A2 9
A1 10
A0 11
NC 12
Q0 13
4
3
2
1
32 31 30
NC
A0-A10
E
Q
V
CC
G
P (Note)
Q1 10
Q2 11
GND 12
14 15 16 17 18 19 20
Q1
Q2
Q3
Q4
GND
NC
Q5
NOTE: P should be hardwired to V
CC
except during programming.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil (and design) is a trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2002. All Rights Reserved
FN3017.1
1

HM6-6617B-9 Related Products

HM6-6617B-9 HM4-6617B-9 HM6-6617-9 HM4-6617-9
Description 2KX8 OTPROM, 105ns, CDIP24, SLIM, SIDE BRAZED, DIP-24 2KX8 OTPROM, 105ns, CQCC32, CERAMIC, LCC-32 2KX8 OTPROM, 140ns, CDIP24 2KX8 OTPROM, 140ns, CQCC32, CERAMIC, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code DIP QFJ DIP QFJ
package instruction SLIM, SIDE BRAZED, DIP-24 QCCN, LCC32,.45X.55 SLIM, SIDE BRAZED, DIP-24 QCCN, LCC32,.45X.55
Contacts 24 32 24 32
Reach Compliance Code not_compliant not_compliant not_compliant _compli
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 105 ns 105 ns 140 ns 140 ns
JESD-30 code R-CDIP-T24 R-CQCC-N32 R-CDIP-T24 R-CQCC-N32
JESD-609 code e0 e0 e0 e0
memory density 16384 bit 16384 bit 16384 bit 16384 bi
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 24 32 24 32
word count 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 2KX8 2KX8 2KX8 2KX8
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP QCCN DIP QCCN
Encapsulate equivalent code DIP24,.3 LCC32,.45X.55 DIP24,.3 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.052 mA 0.052 mA 0.046 mA 0.046 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO YES NO YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL QUAD DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maximum seat height 5.08 mm 3.05 mm - 3.05 mm
width 7.62 mm 11.43 mm - 11.43 mm

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