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HYB25DC512160CF-5

Description
DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60
Categorystorage    storage   
File Size3MB,88 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

HYB25DC512160CF-5 Overview

DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60

HYB25DC512160CF-5 Parametric

Parameter NameAttribute value
MakerInfineon
Parts packaging codeBGA
package instructionTBGA,
Contacts60
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time0.5 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-PBGA-B60
length12 mm
memory density536870912 bit
Memory IC TypeDDR DRAM
memory width16
Number of functions1
Number of ports1
Number of terminals60
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Certification statusNot Qualified
Maximum seat height1.2 mm
self refreshYES
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width10 mm
D a t a S h e e t , Rev. 1.10, O c t . 2 0 0 5
HYB25DC512800C[E/F]
HYB25DC512160C[E/F]
512-Mbit Double-Data-Rate SDRAM
DDR SDRAM
RoHS Compliant Products
Memory Products
N e v e r
s t o p
t h i n k i n g .

HYB25DC512160CF-5 Related Products

HYB25DC512160CF-5 HYB25DC512160CE-6 HYB25DC512800CF-6 HYB25DC512160CF-6 HYB25DC512800CE-6 HYB25DC512160CE-5 HYB25DC512800CF-5 HYB25DC512800CE-5
Description DDR DRAM, 32MX16, 0.5ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 32MX16, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 DDR DRAM, 32MX16, 0.5ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 DDR DRAM, 64MX8, 0.5ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 DDR DRAM, 64MX8, 0.5ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66
Maker Infineon Infineon Infineon Infineon Infineon Infineon Infineon Infineon
Parts packaging code BGA TSOP2 BGA BGA TSOP2 TSOP2 BGA TSOP2
package instruction TBGA, TSSOP, TBGA, TBGA, TSSOP, TSSOP, TBGA, TSSOP,
Contacts 60 66 60 60 66 66 60 66
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknow
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 0.5 ns 0.7 ns 0.7 ns 0.7 ns 0.7 ns 0.5 ns 0.5 ns 0.5 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PBGA-B60 R-PDSO-G66 R-PBGA-B60 R-PBGA-B60 R-PDSO-G66 R-PDSO-G66 R-PBGA-B60 R-PDSO-G66
length 12 mm 22.22 mm 12 mm 12 mm 22.22 mm 22.22 mm 12 mm 22.22 mm
memory density 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bit 536870912 bi
Memory IC Type DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM DDR DRAM
memory width 16 16 8 16 8 16 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 60 66 60 60 66 66 60 66
word count 33554432 words 33554432 words 67108864 words 33554432 words 67108864 words 33554432 words 67108864 words 67108864 words
character code 32000000 32000000 64000000 32000000 64000000 32000000 64000000 64000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 32MX16 32MX16 64MX8 32MX16 64MX8 32MX16 64MX8 64MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TBGA TSSOP TBGA TBGA TSSOP TSSOP TBGA TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
self refresh YES YES YES YES YES YES YES YES
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form BALL GULL WING BALL BALL GULL WING GULL WING BALL GULL WING
Terminal pitch 1 mm 0.65 mm 1 mm 1 mm 0.65 mm 0.65 mm 1 mm 0.65 mm
Terminal location BOTTOM DUAL BOTTOM BOTTOM DUAL DUAL BOTTOM DUAL
width 10 mm 10.16 mm 10 mm 10 mm 10.16 mm 10.16 mm 10 mm 10.16 mm

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