|
MIC8010-01AL |
MIC8010-01BN |
MIC8010-02BN |
MIC8010-02AL |
Description |
Liquid Crystal Driver, 30-Segment, CMOS, CQCC40, CERAMIC, LCC-40 |
Liquid Crystal Driver, 30-Segment, CMOS, PDIP40, PLASTIC, DIP-40 |
Liquid Crystal Driver, 30-Segment, CMOS, PDIP40, PLASTIC, DIP-40 |
Liquid Crystal Driver, 30-Segment, CMOS, CQCC40, CERAMIC, LCC-40 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Micrel ( Microchip ) |
Micrel ( Microchip ) |
Micrel ( Microchip ) |
Micrel ( Microchip ) |
Parts packaging code |
LCC |
DIP |
DIP |
LCC |
package instruction |
QCCN, DIP40,.6 |
DIP, DIP40,.6 |
DIP, DIP40,.6 |
QCCN, DIP40,.6 |
Contacts |
40 |
40 |
40 |
40 |
Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
data entry mode |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
display mode |
DOT MATRIX |
DOT MATRIX |
DOT MATRIX |
DOT MATRIX |
Input properties |
STANDARD |
STANDARD |
STANDARD |
STANDARD |
Interface integrated circuit type |
LIQUID CRYSTAL DISPLAY DRIVER |
LIQUID CRYSTAL DISPLAY DRIVER |
LIQUID CRYSTAL DISPLAY DRIVER |
LIQUID CRYSTAL DISPLAY DRIVER |
JESD-30 code |
S-CQCC-N40 |
R-PDIP-T40 |
R-PDIP-T40 |
S-CQCC-N40 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
Multiplex display function |
NO |
NO |
NO |
NO |
Nominal negative supply voltage |
-25 V |
-25 V |
-25 V |
-25 V |
Number of base plates |
1-BP |
1-BP |
1-BP |
1-BP |
Number of functions |
1 |
1 |
1 |
1 |
Number of segments |
30 |
30 |
30 |
30 |
Number of terminals |
40 |
40 |
40 |
40 |
Maximum operating temperature |
125 °C |
85 °C |
85 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-40 °C |
-40 °C |
-55 °C |
Output characteristics |
TOTEM-POLE |
TOTEM-POLE |
TOTEM-POLE |
TOTEM-POLE |
Output polarity |
TRUE |
TRUE |
TRUE |
TRUE |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
QCCN |
DIP |
DIP |
QCCN |
Encapsulate equivalent code |
DIP40,.6 |
DIP40,.6 |
DIP40,.6 |
DIP40,.6 |
Package shape |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
Package form |
CHIP CARRIER |
IN-LINE |
IN-LINE |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
240 |
NOT SPECIFIED |
NOT SPECIFIED |
240 |
power supply |
5,-25 V |
5,-25 V |
5,-25 V |
5,-25 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.7 mm |
4.318 mm |
4.318 mm |
1.7 mm |
Maximum slew rate |
0.2 mA |
0.2 mA |
0.2 mA |
0.2 mA |
Maximum supply voltage |
18 V |
18 V |
18 V |
18 V |
Minimum supply voltage |
3 V |
3 V |
3 V |
3 V |
Nominal supply voltage |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
NO |
NO |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
NO LEAD |
Terminal pitch |
1.016 mm |
2.54 mm |
2.54 mm |
1.016 mm |
Terminal location |
QUAD |
DUAL |
DUAL |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
12.3 mm |
15.24 mm |
15.24 mm |
12.3 mm |
minfmax |
1 MHz |
1 MHz |
1 MHz |
1 MHz |