IC,EEPROM,2KX8,MOS,DIP,24PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | DIP, DIP24,.6 |
Reach Compliance Code | unknown |
Maximum access time | 350 ns |
command user interface | NO |
Data polling | NO |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
memory density | 16384 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of terminals | 24 |
word count | 2048 words |
character code | 2000 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 2KX8 |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum standby current | 0.05 A |
Maximum slew rate | 0.11 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | MOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
switch bit | NO |