AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDIP14
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
package instruction | DIP, |
Reach Compliance Code | unknown |
Other features | WITH 2 EXPAND INPUTS |
series | TTL/H/L |
JESD-30 code | R-GDIP-T14 |
JESD-609 code | e0 |
length | 19.56 mm |
Logic integrated circuit type | AND-OR-INVERT GATE |
Number of functions | 1 |
Number of entries | 8 |
Number of terminals | 14 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
propagation delay (tpd) | 11 ns |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
SN54H55J | SN54H55W | SN74LS55FN | SNJ54H55W | SN74H55N | SN74LS55J | SNJ54H55J | SN74H55J | |
---|---|---|---|---|---|---|---|---|
Description | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDIP14 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDFP14 | AND-OR-Invert Gate, LS Series, 1-Func, 8-Input, TTL, PQCC20 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDFP14, HERMETIC SEALED, CERAMIC, FP-14 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, PDIP14 | LS SERIES, 8-INPUT AND-OR-INVERT GATE, CDIP14 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 8-Input, TTL, CDIP14 | TTL/H/L SERIES, 8-INPUT AND-OR-INVERT GATE, CDIP14 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
package instruction | DIP, | DFP, | QCCJ, | DFP, | DIP, | DIP, | DIP, | DIP, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
series | TTL/H/L | TTL/H/L | LS | TTL/H/L | TTL/H/L | LS | TTL/H/L | TTL/H/L |
JESD-30 code | R-GDIP-T14 | R-GDFP-F14 | S-PQCC-J20 | R-GDFP-F14 | R-PDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 19.56 mm | 9.21 mm | 8.9662 mm | 8.725 mm | 19.305 mm | 19.56 mm | 19.56 mm | 19.56 mm |
Logic integrated circuit type | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of entries | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 14 | 14 | 20 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DFP | QCCJ | DFP | DIP | DIP | DIP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
propagation delay (tpd) | 11 ns | 11 ns | 20 ns | 11 ns | 11 ns | 20 ns | 11 ns | 11 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | Not Qualified | COMMERCIAL |
Maximum seat height | 5.08 mm | 2.03 mm | 4.57 mm | 2.03 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | YES | NO | NO | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | MILITARY | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | THROUGH-HOLE | FLAT | J BEND | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 6.29 mm | 8.9662 mm | 6.35 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
Other features | WITH 2 EXPAND INPUTS | WITH 2 EXPAND INPUTS; CENTER PIN VCC AND GND | - | WITH 2 EXPAND INPUTS; CENTER PIN VCC AND GND | WITH 2 EXPAND INPUTS | - | WITH 2 EXPAND INPUTS | WITH 2 EXPAND INPUTS |