CD74HC7266E datasheet, PDF - EEWORLD Datasheet

CD74HC7266E: DescriptionXNOR GATE; Categorylogic logic; File Size184KB，4 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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XNOR GATE

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	XNOR GATE
MaximumI(ol)	0.004 A
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Prop。Delay @ Nom-Sup	35 ns
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	CD74HC7266E	CD54HC7266H	CD74HC7266M
Description	XNOR GATE	CD54HC7266H	XNOR GATE
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
package instruction	DIP, DIP14,.3	, DIE OR CHIP	SOP, SOP14,.25
Reach Compliance Code	not_compliant	unknown	not_compliant
Load capacitance (CL)	50 pF	50 pF	50 pF
Logic integrated circuit type	XNOR GATE	XNOR GATE	XNOR GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A
Maximum operating temperature	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C
Encapsulate equivalent code	DIP14,.3	DIE OR CHIP	SOP14,.25
power supply	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	35 ns	35 ns	35 ns
Certification status	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY
Is it Rohs certified?	incompatible	-	incompatible
JESD-30 code	R-PDIP-T14	-	R-PDSO-G14
JESD-609 code	e0	-	e0
Number of terminals	14	-	14
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	DIP	-	SOP
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	-	SMALL OUTLINE
surface mount	NO	-	YES
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	GULL WING
Terminal pitch	2.54 mm	-	1.27 mm
Terminal location	DUAL	-	DUAL

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