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CD54HC7266H

Description
CD54HC7266H
Categorylogic    logic   
File Size184KB,4 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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CD54HC7266H Overview

CD54HC7266H

CD54HC7266H Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
package instruction, DIE OR CHIP
Reach Compliance Codeunknown
Load capacitance (CL)50 pF
Logic integrated circuit typeXNOR GATE
MaximumI(ol)0.004 A
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Encapsulate equivalent codeDIE OR CHIP
power supply2/6 V
Prop。Delay @ Nom-Sup35 ns
Certification statusNot Qualified
Schmitt triggerNO
technologyCMOS
Temperature levelMILITARY

CD54HC7266H Related Products

CD54HC7266H CD74HC7266M CD74HC7266E
Description CD54HC7266H XNOR GATE XNOR GATE
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
package instruction , DIE OR CHIP SOP, SOP14,.25 DIP, DIP14,.3
Reach Compliance Code unknown not_compliant not_compliant
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type XNOR GATE XNOR GATE XNOR GATE
MaximumI(ol) 0.004 A 0.004 A 0.004 A
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
Encapsulate equivalent code DIE OR CHIP SOP14,.25 DIP14,.3
power supply 2/6 V 2/6 V 2/6 V
Prop。Delay @ Nom-Sup 35 ns 35 ns 35 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Is it Rohs certified? - incompatible incompatible
JESD-30 code - R-PDSO-G14 R-PDIP-T14
JESD-609 code - e0 e0
Number of terminals - 14 14
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - SOP DIP
Package shape - RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE IN-LINE
surface mount - YES NO
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - GULL WING THROUGH-HOLE
Terminal pitch - 1.27 mm 2.54 mm
Terminal location - DUAL DUAL
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