EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Integrated Silicon Solution ( ISSI ) |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 5 MHz |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.4 mm |
| memory density | 8192 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 1KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.2 mm |
| Serial bus type | SPI |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Matte Tin (Sn) - annealed |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 5 ms |
| IS25C08-3ZLA3 | IS25C08-3GLA3 | IS25C08-2DLI-TR | IS25C08-2GLI | IS25C08-2CLI | IS25C08-2ZLI | |
|---|---|---|---|---|---|---|
| Description | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, LEAD FREE, CSP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8 |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | TSSOP | SOIC | SON | SOIC | CSP | TSSOP |
| package instruction | TSSOP, | SOP, | VSON, | SOP, | DIE, | TSSOP, |
| Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compli | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum clock frequency (fCLK) | 5 MHz | 5 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-XDSO-N8 | R-PDSO-G8 | R-XUUC-N8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e1 | e3 |
| memory density | 8192 bit | 8192 bi | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | TSSOP | SOP | VSON | SOP | DIE | TSSOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2.5 V | 2.5 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed |
| Terminal form | GULL WING | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING |
| Terminal location | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 | 40 |
| Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Is it lead-free? | Lead free | Lead free | - | Lead free | - | Lead free |
| Maker | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
| length | 4.4 mm | 4.9 mm | 3 mm | 4.9 mm | - | 4.4 mm |
| Humidity sensitivity level | 1 | 3 | 1 | 3 | - | 1 |
| Maximum seat height | 1.2 mm | 1.73 mm | 0.8 mm | 1.73 mm | - | 1.2 mm |
| Terminal pitch | 0.65 mm | 1.27 mm | 0.5 mm | 1.27 mm | - | 0.65 mm |
| width | 3 mm | 3.9 mm | 2 mm | 3.9 mm | - | 3 mm |
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