IS25C08-2GLI datasheet, PDF - EEWORLD Datasheet

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IS25C08-2GLI: DescriptionEEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8; Categorystorage storage; File Size441KB，18 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS25C08-2GLI Overview

EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8

IS25C08-2GLI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	SOIC
package instruction	SOP,
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	10 MHz
JESD-30 code	R-PDSO-G8
JESD-609 code	e3
length	4.9 mm
memory density	8192 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	1024 words
character code	1000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1KX8
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.73 mm
Serial bus type	SPI
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	3.9 mm
Maximum write cycle time (tWC)	5 ms

IS25C08-2GLI Related Products

	IS25C08-2GLI	IS25C08-3GLA3	IS25C08-2DLI-TR	IS25C08-2CLI	IS25C08-2ZLI	IS25C08-3ZLA3
Description	EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8	EEPROM, 1KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8	EEPROM, 1KX8, Serial, CMOS, LEAD FREE, CSP-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8	EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	SOIC	SOIC	SON	CSP	TSSOP	TSSOP
package instruction	SOP,	SOP,	VSON,	DIE,	TSSOP,	TSSOP,
Contacts	8	8	8	8	8	8
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	10 MHz	5 MHz	10 MHz	10 MHz	10 MHz	5 MHz
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-XDSO-N8	R-XUUC-N8	R-PDSO-G8	R-PDSO-G8
JESD-609 code	e3	e3	e3	e1	e3	e3
memory density	8192 bit	8192 bi	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	125 °C	85 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	VSON	DIE	TSSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, VERY THIN PROFILE	UNCASED CHIP	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	SPI	SPI	SPI	SPI	SPI	SPI
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	2.5 V	1.8 V	1.8 V	1.8 V	2.5 V
Nominal supply voltage (Vsup)	2.5 V	5 V	2.5 V	2.5 V	2.5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE
Terminal surface	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn)	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	GULL WING	GULL WING	NO LEAD	NO LEAD	GULL WING	GULL WING
Terminal location	DUAL	DUAL	DUAL	UPPER	DUAL	DUAL
Maximum time at peak reflow temperature	40	40	40	40	40	40
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms	5 ms
Is it lead-free?	Lead free	Lead free	-	-	Lead free	Lead free
Maker	Integrated Silicon Solution ( ISSI )	-	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
length	4.9 mm	4.9 mm	3 mm	-	4.4 mm	4.4 mm
Humidity sensitivity level	3	3	1	-	1	1
Maximum seat height	1.73 mm	1.73 mm	0.8 mm	-	1.2 mm	1.2 mm
Terminal pitch	1.27 mm	1.27 mm	0.5 mm	-	0.65 mm	0.65 mm
width	3.9 mm	3.9 mm	2 mm	-	3 mm	3 mm

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