EEPROM, 1KX8, Serial, CMOS, LEAD FREE, CSP-8
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Integrated Silicon Solution ( ISSI ) |
Parts packaging code | CSP |
package instruction | DIE, |
Contacts | 8 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 10 MHz |
JESD-30 code | R-XUUC-N8 |
JESD-609 code | e1 |
memory density | 8192 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 1024 words |
character code | 1000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 1KX8 |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Package shape | RECTANGULAR |
Package form | UNCASED CHIP |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Serial bus type | SPI |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 1.8 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | NO LEAD |
Terminal location | UPPER |
Maximum time at peak reflow temperature | 40 |
Maximum write cycle time (tWC) | 5 ms |
IS25C08-2CLI | IS25C08-3GLA3 | IS25C08-2DLI-TR | IS25C08-2GLI | IS25C08-2ZLI | IS25C08-3ZLA3 | |
---|---|---|---|---|---|---|
Description | EEPROM, 1KX8, Serial, CMOS, LEAD FREE, CSP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8 |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
Parts packaging code | CSP | SOIC | SON | SOIC | TSSOP | TSSOP |
package instruction | DIE, | SOP, | VSON, | SOP, | TSSOP, | TSSOP, |
Contacts | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | compliant | compli | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum clock frequency (fCLK) | 10 MHz | 5 MHz | 10 MHz | 10 MHz | 10 MHz | 5 MHz |
JESD-30 code | R-XUUC-N8 | R-PDSO-G8 | R-XDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609 code | e1 | e3 | e3 | e3 | e3 | e3 |
memory density | 8192 bit | 8192 bi | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
Package body material | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIE | SOP | VSON | SOP | TSSOP | TSSOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | UNCASED CHIP | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Serial bus type | SPI | SPI | SPI | SPI | SPI | SPI |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 1.8 V | 2.5 V | 1.8 V | 1.8 V | 1.8 V | 2.5 V |
Nominal supply voltage (Vsup) | 2.5 V | 5 V | 2.5 V | 2.5 V | 2.5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) | Matte Tin (Sn) - annealed | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
Terminal form | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING |
Terminal location | UPPER | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 | 40 | 40 |
Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
Maker | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
Is it lead-free? | - | Lead free | - | Lead free | Lead free | Lead free |
length | - | 4.9 mm | 3 mm | 4.9 mm | 4.4 mm | 4.4 mm |
Humidity sensitivity level | - | 3 | 1 | 3 | 1 | 1 |
Maximum seat height | - | 1.73 mm | 0.8 mm | 1.73 mm | 1.2 mm | 1.2 mm |
Terminal pitch | - | 1.27 mm | 0.5 mm | 1.27 mm | 0.65 mm | 0.65 mm |
width | - | 3.9 mm | 2 mm | 3.9 mm | 3 mm | 3 mm |