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IS25C08-2CLI

Description
EEPROM, 1KX8, Serial, CMOS, LEAD FREE, CSP-8
Categorystorage    storage   
File Size441KB,18 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Environmental Compliance
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IS25C08-2CLI Overview

EEPROM, 1KX8, Serial, CMOS, LEAD FREE, CSP-8

IS25C08-2CLI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeCSP
package instructionDIE,
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)10 MHz
JESD-30 codeR-XUUC-N8
JESD-609 codee1
memory density8192 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count1024 words
character code1000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1KX8
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Serial bus typeSPI
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperature40
Maximum write cycle time (tWC)5 ms

IS25C08-2CLI Related Products

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Description EEPROM, 1KX8, Serial, CMOS, LEAD FREE, CSP-8 EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8 EEPROM, 1KX8, Serial, CMOS, LEAD FREE, MO-229, DFN-8 EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, LEAD FREE, SOIC-8 EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8 EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.169 INCH, LEAD FREE, MO-153, TSSOP-8
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Parts packaging code CSP SOIC SON SOIC TSSOP TSSOP
package instruction DIE, SOP, VSON, SOP, TSSOP, TSSOP,
Contacts 8 8 8 8 8 8
Reach Compliance Code compliant compli compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 10 MHz 5 MHz 10 MHz 10 MHz 10 MHz 5 MHz
JESD-30 code R-XUUC-N8 R-PDSO-G8 R-XDSO-N8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e1 e3 e3 e3 e3 e3
memory density 8192 bit 8192 bi 8192 bit 8192 bit 8192 bit 8192 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8
word count 1024 words 1024 words 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000 1000 1000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 125 °C 85 °C 85 °C 85 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 1KX8 1KX8 1KX8 1KX8 1KX8 1KX8
Package body material UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIE SOP VSON SOP TSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form UNCASED CHIP SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type SPI SPI SPI SPI SPI SPI
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 2.5 V 1.8 V 1.8 V 1.8 V 2.5 V
Nominal supply voltage (Vsup) 2.5 V 5 V 2.5 V 2.5 V 2.5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL AUTOMOTIVE
Terminal surface Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed Matte Tin (Sn) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal form NO LEAD GULL WING NO LEAD GULL WING GULL WING GULL WING
Terminal location UPPER DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 40 40 40 40 40
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms 5 ms 5 ms
Maker Integrated Silicon Solution ( ISSI ) - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Is it lead-free? - Lead free - Lead free Lead free Lead free
length - 4.9 mm 3 mm 4.9 mm 4.4 mm 4.4 mm
Humidity sensitivity level - 3 1 3 1 1
Maximum seat height - 1.73 mm 0.8 mm 1.73 mm 1.2 mm 1.2 mm
Terminal pitch - 1.27 mm 0.5 mm 1.27 mm 0.65 mm 0.65 mm
width - 3.9 mm 2 mm 3.9 mm 3 mm 3 mm

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