LH532100BSR-1 datasheet, PDF - EEWORLD Datasheet

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LH532100BSR-1: DescriptionMASK ROM, 256KX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32; Categorystorage storage; File Size175KB，8 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH532100BSR-1 Overview

MASK ROM, 256KX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32

LH532100BSR-1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.400 INCH, PLASTIC, REVERSE, TSOP2-32
Reach Compliance Code	unknown
Maximum access time	120 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
memory density	2097152 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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LH532100BSR-1 Related Products

	LH532100BSR-1	LH532100BT-1	LH532100BN-1	LH532100BU-1	LH532100BD-1	LH532100BS-1
Description	MASK ROM, 256KX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32	MASK ROM, 256KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32	MASK ROM, 256KX8, 120ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	MASK ROM, 256KX8, 120ns, CMOS, PQCC32, 0.450 INCH, PLASTIC, LCC-32	MASK ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 256KX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	SHARP	SHARP	SHARP	SHARP	SHARP	SHARP
package instruction	0.400 INCH, PLASTIC, REVERSE, TSOP2-32	8 X 20 MM, PLASTIC, TSOP1-32	0.525 INCH, PLASTIC, SOP-32	0.450 INCH, PLASTIC, LCC-32	0.600 INCH, PLASTIC, DIP-32	0.400 INCH, PLASTIC, TSOP2-32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	120 ns	120 ns	120 ns	120 ns	120 ns	120 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PQCC-J32	R-PDIP-T32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	SOP	SOP	QCCJ	DIP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	CHIP CARRIER	IN-LINE	SMALL OUTLINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	J BEND	THROUGH-HOLE	GULL WING
Terminal location	DUAL	DUAL	DUAL	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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