Fast Page DRAM, 256KX4, 70ns, CMOS, PZIP19, 0.400 INCH, ZIP-20/19
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | ZIP |
package instruction | ZIP, ZIP20,.1 |
Contacts | 20 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 70 ns |
Other features | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
I/O type | COMMON |
JESD-30 code | R-PZIP-T19 |
JESD-609 code | e0 |
length | 26.165 mm |
memory density | 1048576 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 4 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 19 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX4 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | ZIP |
Encapsulate equivalent code | ZIP20,.1 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 512 |
Maximum seat height | 10.16 mm |
Maximum standby current | 0.0001 A |
Maximum slew rate | 0.055 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.27 mm |
Terminal location | ZIG-ZAG |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 2.96 mm |