W24256-70LL datasheet, PDF - EEWORLD Datasheet

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W24256-70LL: Description32K X 8 CMOS STATIC RAM; Categorystorage storage; File Size95KB，10 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W24256-70LL Overview

32K X 8 CMOS STATIC RAM

W24256-70LL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	DIP
package instruction	0.600 INCH, PLASTIC, DIP-28
Contacts	28
Reach Compliance Code	_compli
ECCN code	EAR99
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	37.08 mm
memory density	262144 bi
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.33 mm
Minimum standby current	2 V
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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Preliminary W24256

32K

8 CMOS STATIC RAM

GENERAL DESCRIPTION

The W24256 is a normal speed, very low power CMOS static RAM organized as 32768

8 bits that

operates on a single 5-volt power supply. This device is manufactured using Winbond's high

performance CMOS technology.

FEATURES

•

Low power consumption:

•

Access time: 70 nS (max.)

•

Active :300 mW

Standby :250

µW

•

Single 5V power supply

•

Fully static operation

•

All inputs and outputs directly TTL compatible

•

Three-state outputs

Battery back-up operation capability

Data retention voltage: 2V (min.)

Packaged in 28-pin 600 mil DIP, 330 mil SOP

and standard type one TSOP (8 mm

13.4

mm)

PIN CONFIGURATIONS

BLOCK DIAGRAM

CLK GEN.

A12

A14

PRECHARGE CKT.

A14

A12

I/O1

I/O2

I/O3

28-pin

DIP

A13

A11

A10

I/O8

I/O7

I/O6

I/O5

I/O4

A13

I/O1

I/O8

CORE CELL ARRAY

512 ROWS

64 X 8 COLUMNS

DATA

CNTRL.

CLK

GEN.

I/O CKT.

COLUMN DECODER

A11 A10 A1 A0 A8 A9

PIN DESCRIPTION

A11

A13

A14

A12

A10

I/O8

I/O7

I/O6

I/O5

I/O4

I/O3

I/O2

I/O1

SYMBOL

A0−A14

I/O1−I/O8

28-pin

TSOP

DESCRIPTION

Address Inputs

Data Inputs/Outputs

Chip Select Input

Write Enable Input

Output Enable Input

Power Supply

Ground

-1-

Publication Release Date: October 1999

Revision A1

W24256-70LL Related Products

	W24256-70LL	W24256-70	W24256S-70L	W24256Q-70L	W24256Q-70LL	W24256S-70LL	W24256	W24256-70L
Description	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM	32K X 8 CMOS STATIC RAM
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	-	incompatible
Maker	Winbond Electronics Corporation	-	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation	-	Winbond Electronics Corporation
Parts packaging code	DIP	-	SOIC	TSOP	TSOP	SOIC	-	DIP
package instruction	0.600 INCH, PLASTIC, DIP-28	-	0.330 INCH, SOP-28	8 X 13.40 MM, TSOP1-28	8 X 13.40 MM, TSOP1-28	0.330 INCH, SOP-28	-	0.600 INCH, PLASTIC, DIP-28
Contacts	28	-	28	28	28	28	-	28
Reach Compliance Code	_compli	-	_compli	_compli	_compli	_compli	-	_compli
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	-	EAR99
Maximum access time	70 ns	-	70 ns	70 ns	70 ns	70 ns	-	70 ns
I/O type	COMMON	-	COMMON	COMMON	COMMON	COMMON	-	COMMON
JESD-30 code	R-PDIP-T28	-	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	-	R-PDIP-T28
JESD-609 code	e0	-	e0	e0	e0	e0	-	e0
length	37.08 mm	-	18.11 mm	11.8 mm	11.8 mm	18.11 mm	-	37.08 mm
memory density	262144 bi	-	262144 bi	262144 bi	262144 bi	262144 bi	-	262144 bi
Memory IC Type	STANDARD SRAM	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	-	STANDARD SRAM
memory width	8	-	8	8	8	8	-	8
Number of functions	1	-	1	1	1	1	-	1
Number of terminals	28	-	28	28	28	28	-	28
word count	32768 words	-	32768 words	32768 words	32768 words	32768 words	-	32768 words
character code	32000	-	32000	32000	32000	32000	-	32000
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C	70 °C	-	70 °C
organize	32KX8	-	32KX8	32KX8	32KX8	32KX8	-	32KX8
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	DIP	-	SOP	TSOP1	TSOP1	SOP	-	DIP
Encapsulate equivalent code	DIP28,.6	-	SOP28,.45	TSSOP28,.53,22	TSSOP28,.53,22	SOP28,.45	-	DIP28,.6
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	-	IN-LINE
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	240	240	NOT SPECIFIED	-	NOT SPECIFIED
power supply	5 V	-	5 V	5 V	5 V	5 V	-	5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	5.33 mm	-	2.85 mm	1.2 mm	1.2 mm	2.85 mm	-	5.33 mm
Minimum standby current	2 V	-	2 V	2 V	2 V	2 V	-	2 V
Maximum slew rate	0.06 mA	-	0.06 mA	0.06 mA	0.06 mA	0.06 mA	-	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	-	4.5 V
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V	5 V	-	5 V
surface mount	NO	-	YES	YES	YES	YES	-	NO
technology	CMOS	-	CMOS	CMOS	CMOS	CMOS	-	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	GULL WING	GULL WING	GULL WING	GULL WING	-	THROUGH-HOLE
Terminal pitch	2.54 mm	-	1.27 mm	0.55 mm	0.55 mm	1.27 mm	-	2.54 mm
Terminal location	DUAL	-	DUAL	DUAL	DUAL	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	30	30	NOT SPECIFIED	-	NOT SPECIFIED
width	15.24 mm	-	8.41 mm	8 mm	8 mm	8.41 mm	-	15.24 mm

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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