|
M54HC283F1 |
M74HC283F1 |
M74HC283M1 |
M74HC283B1N |
M74HC283C1 |
Description |
HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, CDIP16, FRIT SEALED, CERAMIC, DIP-16 |
HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, CDIP16, FRIT SEALED, CERAMIC, DIP-16 |
HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, PDSO16, MICRO, PLASTIC, DIP-16 |
HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, PDIP16, PLASTIC, DIP-16 |
HC/UH SERIES, 4-BIT ADDER/SUBTRACTOR, PQCC20, PLASTIC, CC-20 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
Parts packaging code |
DIP |
DIP |
SOIC |
DIP |
QFN |
package instruction |
DIP, DIP16,.3 |
FRIT SEALED, CERAMIC, DIP-16 |
SOP, SOP16,.25 |
DIP, DIP16,.3 |
PLASTIC, CC-20 |
Contacts |
16 |
16 |
16 |
16 |
20 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
Other features |
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING |
series |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
HC/UH |
JESD-30 code |
R-GDIP-T16 |
R-GDIP-T16 |
R-PDSO-G16 |
R-PDIP-T16 |
S-PQCC-J20 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
ADDER/SUBTRACTOR |
Number of digits |
4 |
4 |
4 |
4 |
4 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
16 |
16 |
16 |
16 |
20 |
Maximum operating temperature |
125 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-55 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
CERAMIC, GLASS-SEALED |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
DIP |
SOP |
DIP |
QCCJ |
Encapsulate equivalent code |
DIP16,.3 |
DIP16,.3 |
SOP16,.25 |
DIP16,.3 |
LDCC20,.4SQ |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
SQUARE |
Package form |
IN-LINE |
IN-LINE |
SMALL OUTLINE |
IN-LINE |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
2/6 V |
propagation delay (tpd) |
81 ns |
68 ns |
68 ns |
68 ns |
68 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
5 mm |
5 mm |
1.75 mm |
5.1 mm |
4.57 mm |
Maximum supply voltage (Vsup) |
6 V |
6 V |
6 V |
6 V |
6 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
2 V |
2 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
NO |
NO |
YES |
NO |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
THROUGH-HOLE |
J BEND |
Terminal pitch |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
7.62 mm |
7.62 mm |
3.9 mm |
7.62 mm |
8.9662 mm |