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MAX2361ETM

Description
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
CategoryTelecom circuit   
File Size1MB,31 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

MAX2361ETM Overview

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48

MAX2361ETM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeQFN
package instruction7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
Contacts48
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 codeS-XQCC-N48
JESD-609 codee0
length7 mm
Humidity sensitivity level1
Number of functions1
Number of terminals48
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height0.8 mm
Nominal supply voltage2.8 V
surface mountYES
Telecom integrated circuit typesRF AND BASEBAND CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width7 mm
Base Number Matches1

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Description TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code QFN QFN QFN QFN QFN QFN
package instruction 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48
Contacts 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Is Samacsys N N N N N N
JESD-30 code S-XQCC-N48 S-XQCC-N48 S-XQCC-N48 S-XQCC-N48 S-XQCC-N48 S-XQCC-N48
JESD-609 code e0 e0 e0 e0 e0 e3
length 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm
Humidity sensitivity level 1 1 3 3 3 1
Number of functions 1 1 1 1 1 1
Number of terminals 48 48 48 48 48 48
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN HVQCCN
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 240 240 245 245 245 260
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 0.8 mm 0.8 mm 1 mm 1 mm 1 mm 0.8 mm
Nominal supply voltage 2.8 V 2.8 V 2.8 V 2.8 V 2.8 V 2.8 V
surface mount YES YES YES YES YES YES
Telecom integrated circuit types RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
Maximum time at peak reflow temperature 20 20 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7 mm 7 mm 7 mm 7 mm 7 mm 7 mm
Base Number Matches 1 1 1 1 1 1
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