|
MAX2361ETM |
MAX2363ETM |
MAX2361EGM |
MAX2363EGM |
MAX2365EGM |
MAX2363ETM+ |
Description |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC48, 7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Maker |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Rochester Electronics |
Parts packaging code |
QFN |
QFN |
QFN |
QFN |
QFN |
QFN |
package instruction |
7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
7 X 7 MM, 0.90 MM HEIGHT, MO-220, QFN-48 |
7 X 7 MM, 0.80 MM HEIGHT, MO-220, TQFN-48 |
Contacts |
48 |
48 |
48 |
48 |
48 |
48 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
Is Samacsys |
N |
N |
N |
N |
N |
N |
JESD-30 code |
S-XQCC-N48 |
S-XQCC-N48 |
S-XQCC-N48 |
S-XQCC-N48 |
S-XQCC-N48 |
S-XQCC-N48 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e3 |
length |
7 mm |
7 mm |
7 mm |
7 mm |
7 mm |
7 mm |
Humidity sensitivity level |
1 |
1 |
3 |
3 |
3 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
48 |
48 |
48 |
48 |
48 |
48 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
HVQCCN |
HVQCCN |
HVQCCN |
HVQCCN |
HVQCCN |
HVQCCN |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
240 |
240 |
245 |
245 |
245 |
260 |
Certification status |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Maximum seat height |
0.8 mm |
0.8 mm |
1 mm |
1 mm |
1 mm |
0.8 mm |
Nominal supply voltage |
2.8 V |
2.8 V |
2.8 V |
2.8 V |
2.8 V |
2.8 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
Telecom integrated circuit types |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
RF AND BASEBAND CIRCUIT |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
20 |
20 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
7 mm |
7 mm |
7 mm |
7 mm |
7 mm |
7 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
- |