Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LG Semicon Co., Ltd. |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.006 A |
Number of functions | 1 |
Number of entries | 8 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6 V |
Prop。Delay @ Nom-Sup | 60 ns |
Certification status | Not Qualified |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
GD54HC251J | GD54HCT251J | GD74HC251J | GD74HC251D | GD74HC251 | GD74HCT251 | GD74HCT251J | GD74HCT251D | |
---|---|---|---|---|---|---|---|---|
Description | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, PDSO16, | Multiplexer, 1-Func, 8 Line Input, CMOS, PDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, PDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, CDIP16, | Multiplexer, 1-Func, 8 Line Input, CMOS, PDSO16, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maker | LG Semicon Co., Ltd. | - | LG Semicon Co., Ltd. | - | - | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. |
JESD-30 code | R-XDIP-T16 | R-XDIP-T16 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDSO-G16 |
JESD-609 code | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
MaximumI(ol) | 0.006 A | 0.006 A | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
Number of functions | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
Number of entries | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 16 | 16 | - | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 125 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -55 °C | -55 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Output characteristics | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | - | SOP | DIP | DIP | DIP | SOP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | - | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 |
Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | - | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
power supply | 2/6 V | 5 V | - | 2/6 V | 2/6 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Sup | 60 ns | 72 ns | - | 51 ns | 51 ns | 60 ns | 60 ns | 60 ns |
Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | - | YES | NO | NO | NO | YES |
technology | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |