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PCA8574AD,112

Description
8 I/O, PIA-GENERAL PURPOSE, PDSO16
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size160KB,27 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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PCA8574AD,112 Overview

8 I/O, PIA-GENERAL PURPOSE, PDSO16

PCA8574AD,112 Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-10-15 00:00:00
Brand NameNXP Semiconduc
MakerNXP
Parts packaging codeSOP
package instructionSOP,
Contacts16
Manufacturer packaging codeSOT162-1
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length10.3 mm
Number of I/O lines8
Number of ports1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum seat height2.65 mm
Maximum supply voltage5.5 V
Minimum supply voltage2.3 V
Nominal supply voltage3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm
uPs/uCs/peripheral integrated circuit typePARALLEL IO PORT, GENERAL PURPOSE

PCA8574AD,112 Related Products

PCA8574AD,112 PCA8574TS,112 PCA8574TS,118 PCA8574PW,112
Description 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16 8 I/O, PIA-GENERAL PURPOSE, PDSO16
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
Maker NXP NXP NXP NXP
Parts packaging code SOP SSOP2 SSOP2 TSSOP
package instruction SOP, LSSOP, SSOP20,.25 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20 TSSOP, TSSOP20,.25
Contacts 16 20 20 16
Manufacturer packaging code SOT162-1 SOT266-1 SOT266-1 SOT403-1
Reach Compliance Code unknow compli compli compli
JESD-30 code R-PDSO-G16 R-PDSO-G20 R-PDSO-G20 R-PDSO-G16
JESD-609 code e4 e4 e4 e4
length 10.3 mm 6.5 mm 6.5 mm 5 mm
Number of I/O lines 8 8 8 8
Number of ports 1 1 1 1
Number of terminals 16 20 20 16
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP LSSOP LSSOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Maximum seat height 2.65 mm 1.5 mm 1.5 mm 1.1 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage 3 V 3 V 3 V 3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
width 7.5 mm 4.4 mm 4.4 mm 4.4 mm
uPs/uCs/peripheral integrated circuit type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Is it Rohs certified? - conform to conform to conform to
Humidity sensitivity level - 1 1 1
Number of digits - 8 8 8
Encapsulate equivalent code - SSOP20,.25 SSOP20,.25 TSSOP20,.25
Peak Reflow Temperature (Celsius) - 260 260 260
power supply - 2.5/5 V 2.5/5 V 2.5/5 V
Certification status - Not Qualified Not Qualified Not Qualified
Maximum time at peak reflow temperature - 30 30 30

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