SRAM Module, 1MX8, 30ns, CMOS, CQIP52, 0.145 INCH HEIGHT, STRAIGHT, STACK, HERMETIC SEALED, CERAMIC, SLCC-52
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Twilight Technology Inc. |
Parts packaging code | QIP |
package instruction | QIP, |
Contacts | 52 |
Reach Compliance Code | unknown |
ECCN code | 3A001.A.2.C |
Maximum access time | 30 ns |
JESD-30 code | R-CQIP-T52 |
length | 24.892 mm |
memory density | 8388608 bit |
Memory IC Type | SRAM MODULE |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 52 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 1MX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | QIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum seat height | 3.683 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14.224 mm |