|
PUMD48,125 |
PEMD48,115 |
PUMD48,115 |
PUMD48,165 |
Description |
100 mA, 50 V, 2 CHANNEL, NPN AND PNP, Si, SMALL SIGNAL TRANSISTOR |
100 mA, 50 V, 2 CHANNEL, NPN AND PNP, Si, SMALL SIGNAL TRANSISTOR |
100 mA, 50 V, 2 CHANNEL, NPN AND PNP, Si, SMALL SIGNAL TRANSISTOR |
100 mA, 50 V, 2 CHANNEL, NPN AND PNP, Si, SMALL SIGNAL TRANSISTOR |
Brand Name |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconduc |
NXP Semiconduc |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Maker |
NXP |
NXP |
NXP |
NXP |
Parts packaging code |
TSSOP |
SOT |
TSSOP |
TSSOP |
Contacts |
6 |
6 |
6 |
6 |
Manufacturer packaging code |
SOT363 |
SOT666 |
SOT363 |
SOT363 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
Minimum DC current gain (hFE) |
80 |
80 |
80 |
80 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
Number of components |
2 |
2 |
2 |
2 |
Polarity/channel type |
NPN/PNP |
NPN AND PNP |
NPN AND PNP |
NPN AND PNP |
Maximum power dissipation(Abs) |
0.3 W |
0.3 W |
0.3 W |
0.3 W |
surface mount |
YES |
YES |
YES |
YES |
Terminal surface |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Tin (Sn) |
Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
package instruction |
- |
PLASTIC PACKAGE-6 |
PLASTIC, SC-88, 6 PIN |
PLASTIC, SC-88, 6 PIN |
ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
Other features |
- |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
BUILT IN BIAS RESISTANCE RATIO IS 21.36 |
Maximum collector current (IC) |
- |
0.1 A |
0.1 A |
0.1 A |
Collector-emitter maximum voltage |
- |
50 V |
50 V |
50 V |
Configuration |
- |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
JESD-30 code |
- |
R-PDSO-F6 |
R-PDSO-G6 |
R-PDSO-G6 |
Number of terminals |
- |
6 |
6 |
6 |
Maximum operating temperature |
- |
150 °C |
150 °C |
150 °C |
Package body material |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
Package shape |
- |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
- |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE |
Peak Reflow Temperature (Celsius) |
- |
NOT SPECIFIED |
260 |
260 |
Certification status |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Terminal form |
- |
FLAT |
GULL WING |
GULL WING |
Terminal location |
- |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
- |
NOT SPECIFIED |
40 |
40 |
transistor applications |
- |
SWITCHING |
SWITCHING |
SWITCHING |