0.2A, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | DO-34 |
package instruction | HERMETIC SEALED, GLASS PACKAGE-2 |
Contacts | 2 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Shell connection | ISOLATED |
Configuration | SINGLE |
Diode component materials | SILICON |
Diode type | RECTIFIER DIODE |
Maximum forward voltage (VF) | 0.8 V |
JEDEC-95 code | DO-34 |
JESD-30 code | O-LALF-W2 |
JESD-609 code | e3 |
Maximum non-repetitive peak forward current | 0.6 A |
Number of components | 1 |
Number of terminals | 2 |
Maximum operating temperature | 125 °C |
Maximum output current | 0.2 A |
Package body material | GLASS |
Package shape | ROUND |
Package form | LONG FORM |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Guideline | CECC50001-059 |
Maximum repetitive peak reverse voltage | 30 V |
Maximum reverse current | 2 µA |
Maximum reverse recovery time | 0.004 µs |
surface mount | NO |
technology | SCHOTTKY |
Terminal surface | Matte Tin (Sn) |
Terminal form | WIRE |
Terminal location | AXIAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
BAT85AMO | 933624760116 | 933624760113 | BAT85/A52A | BAT85/A52R | 933624760112 | 933624760153 | 933624760133 | |
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Description | 0.2A, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2 | DIODE 0.2 A, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode | 0.2A, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2 | 0.2A, 30V, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2 | 0.2A, 30V, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2 | DIODE 0.2 A, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode | DIODE 0.2 A, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2, Signal Diode | 0.2A, 30V, SILICON, SIGNAL DIODE, DO-34, HERMETIC SEALED, GLASS PACKAGE-2 |
Maker | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
Parts packaging code | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 |
package instruction | HERMETIC SEALED, GLASS PACKAGE-2 | O-LALF-W2 | HERMETIC SEALED, GLASS PACKAGE-2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | HERMETIC SEALED, GLASS PACKAGE-2 |
Contacts | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Shell connection | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
JEDEC-95 code | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 | DO-34 |
JESD-30 code | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Maximum output current | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A | 0.2 A |
Package body material | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS | GLASS |
Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
Package form | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum reverse recovery time | 0.004 µs | 0.004 µs | 0.004 µs | 0.004 µs | 0.004 µs | 0.004 µs | 0.004 µs | 0.004 µs |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
technology | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY | SCHOTTKY |
Terminal form | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE | WIRE |
Terminal location | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL |
Is it Rohs certified? | conform to | conform to | conform to | - | - | conform to | - | conform to |
JESD-609 code | e3 | e3 | e3 | - | - | e3 | - | e3 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | 260 | - | - | NOT SPECIFIED | - | 260 |
Terminal surface | Matte Tin (Sn) | TIN | PURE TIN | - | - | TIN | - | PURE TIN |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | 30 | - | - | NOT SPECIFIED | - | 30 |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |