Twin Diode Module
TDM300
B
Baseplate
A=Common Anode
A
B
C
D
E
F
G
H
J
K
L
M
A
D
E
Dim. Inches
Min.
---
1.240
---
3.99 BSC
1.98 BSC
0.320
---
0.630
0.680
0.610
---
0.182
Millimeters
Min.
---
31.49
---
101.34 BSC
50.29 BSC
8.13
---
16.00
17.27
15.49
---
4.62
Max.
4.600
1.260
.925
Max.
116.84
32.00
23.49
Notes
F
G
Baseplate
Common Cathode
H
C
L
J
M
Baseplate
D=Doubler
Notes:
Baseplate: Nickel plated
copper.
K
H
0.340
---
---
0.780
0.640
.100
0.192
8.64
---
---
19.81
16.26
2.54
4.88
Dia.
5/16-18
Working Peak
Microsemi
Repetitive Peak
Reverse Voltage
Catalog Number
Reverse Voltage
200V
TDM30002*
200V
400V
TDM30004*
400V
600V
TDM30006*
600V
800V
TDM30008*
800V
TDM30010*
1000V
1000V
TDM30012*
1200V
1200V
TDM30014*
1400V
1400V
TDM30016*
1600V
1600V
*Add Suffix A for Common Anode, D for Doubler
Compact Package
Glass Passivated Die
2 x 300 Amp Current Rating
Simplifies Circuit Assembly
Non-Isolated Baseplate
VRRM 200-1600 Volts
ROHS Compliant
Electrical Characteristics
Average forward current per pkg
Average forward current per leg
Maximum surge current per leg
Max I
2
t for fusing
Max peak forward voltage per leg
Max peak reverse current per leg
Max peak reverse current per leg
I F(AV) 600 Amps
I F(AV) 300 Amps
I FSM 5500 Amps
I
2
t 125990 A
2
s
VFM 1.1 Volts
I RM 10 mA
I RM 75 uA
T C = 130°C, half sine, R 0JC = 0.08°C/W
T C = 130°C, half sine, R 0JC = 0.15°C/W
8.3 ms, half sine,T J = 175°C
I FM = 300A: J = 25°C*
T
VRRM,T J = 150°C
VRRM,T J = 25°C*
*Pulse test: Pulse width 8.33 msec, Duty cycle <1%
Thermal and Mechanical Characteristics
Storage temp range
Operating junction temp range
Max thermal resistance per leg
Typical thermal resistance per leg (greased)
Terminal Torque
Mounting Base Torque (outside holes)
Mounting Base Torque (center hole)
center hole must be torqued first
Weight
T STG
TJ
R OJC
R OCS
-55°C to 175°C
-55°C to 175°C
0.15°C/W Junction to case
0.04°C/W Case to sink
60-75 inch pounds
30-40 inch pounds
8-10 inch pounds
9.3 ounces (263.7 grams) typical
www.microsemi.com
January, 2010 - Rev. 3
TDM300
Maximum Allowable Case Temperature - C
Figure 1
Typical Forward Characteristics - Per Leg
10000
8000
6000
4000
Figure 3
Forward Current Derating - Per Leg
175
165
155
145
135
125
115
105
0
60
100
120
200
180
300
DC
400
500
2000
1000
800
600
400
175 C
Instantaneous Forward Current - Amperes
200
25 C
Average Forward Current - Amperes
Figure 4
Maximum Forward Power Dissipation - Per Leg
Maximum Power Dissipation - Watts
350
300
250
200
150
100
50
0
0
100
200
300
400
500
Average Forward Current - Amperes
Figure 5
Transient Thermal Impedance - Per Leg
Thermal Impedance - C/Watts
.21
.18
.15
.12
.09
.06
.03
0
.001
120
60
180
DC
100
80
60
40
20
10
.5
.7
.9
1.1
1.3
1.5
1.7
1.9
Instantaneous Forward Voltage - Volts
Figure 2
Typical Reverse Characteristics - Per Leg
100
Typical Reverse Current - mA
10
175 C
1
.1
75 C
.01
25 C
0
200
600
1000
1400
1800
.001
Junction to Case
150 C
.01
.1
1
10
100
Reverse Voltage - Volts
Time in Seconds
www.microsemi.com
January, 2010 - Rev. 3
MEMS sensors
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