CY7C1007L-15PC datasheet, PDF - EEWORLD Datasheet

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CY7C1007L-15PC: DescriptionStandard SRAM, 1MX1, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size174KB，8 Pages; ManufacturerCypress Semiconductor

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CY7C1007L-15PC Overview

Standard SRAM, 1MX1, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

CY7C1007L-15PC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	15 ns
Other features	AUTOMATIC POWER-DOWN
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
length	35.4965 mm
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	28
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX1
Output characteristics	3-STATE
Exportable	NO
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.826 mm
Minimum standby current	2 V
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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CY7C1007L-15PC Related Products

	CY7C1007L-15PC	CY7C1007L-20DMB	CY7C1007L-20PC	CY7C1007L-25VC	CY7C1007L-12VC	CY7C1007L-25DMB	CY7C1007L-15VC	CY7C1007L-15DMB	CY7C1007L-20VC	CY7C1007L-25PC
Description	Standard SRAM, 1MX1, 15ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 1MX1, 20ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28	Standard SRAM, 1MX1, 20ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28	Standard SRAM, 1MX1, 25ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 1MX1, 12ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 1MX1, 25ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28	Standard SRAM, 1MX1, 15ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 1MX1, 15ns, CMOS, CDIP28, 0.300 INCH, CERDIP-28	Standard SRAM, 1MX1, 20ns, CMOS, PDSO28, 0.300 INCH, PLASTIC, SOJ-28	Standard SRAM, 1MX1, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Parts packaging code	DIP	DIP	DIP	SOJ	SOJ	DIP	SOJ	DIP	SOJ	DIP
package instruction	DIP,	DIP,	DIP,	0.300 INCH, PLASTIC, SOJ-28	SOJ,	DIP,	SOJ,	DIP,	SOJ,	DIP,
Contacts	28	28	28	28	28	28	28	28	28	28
Reach Compliance Code	compliant	compliant	compliant	unknown	unknown	compliant	unknown	compliant	compliant	compliant
ECCN code	3A991.B.2.B	3A001.A.2.C	3A991.B.2.B	EAR99	3A991.B.2.B	3A001.A.2.C	3A991.B.2.B	3A001.A.2.C	3A991.B.2.B	EAR99
Maximum access time	15 ns	20 ns	20 ns	25 ns	12 ns	25 ns	15 ns	15 ns	20 ns	25 ns
Other features	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
JESD-30 code	R-PDIP-T28	R-GDIP-T28	R-PDIP-T28	R-PDSO-J28	R-PDSO-J28	R-GDIP-T28	R-PDSO-J28	R-GDIP-T28	R-PDSO-J28	R-PDIP-T28
length	35.4965 mm	37.0205 mm	35.4965 mm	17.907 mm	17.907 mm	37.0205 mm	17.907 mm	37.0205 mm	17.907 mm	35.4965 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	1	1	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28	28	28	28	28
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C	70 °C	125 °C	70 °C	125 °C	70 °C	70 °C
organize	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	SOJ	SOJ	DIP	SOJ	DIP	SOJ	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.826 mm	5.08 mm	4.826 mm	3.556 mm	3.556 mm	5.08 mm	3.556 mm	5.08 mm	3.556 mm	4.826 mm
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	NO	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.62 mm	7.62 mm	7.5 mm	7.5 mm	7.62 mm	7.5 mm	7.62 mm	7.5 mm	7.62 mm
Is it lead-free?	Contains lead	Contains lead	Contains lead	-	-	Contains lead	-	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	-	-	incompatible	-	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
JESD-609 code	e0	e0	e0	-	-	e0	-	e0	e0	e0
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	-	NOT SPECIFIED	220	NOT SPECIFIED
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	-	-	TIN LEAD	-	TIN LEAD	TIN LEAD	TIN LEAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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