TLWLK1109(T11)
TOSHIBA LED Lamp
TLWLK1109(T11)
Panel Circuit Indicators
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Surface-mount devices
3.2 (L) × 2.9 (W) × 1.9 (H) mm
LED chip and phosphor
Luminous intensity: Iv = 2500 mcd (typ.) @40 mA
Color: white (Warm White)
Topr / Tstg = -40 to 100°C
Applications: automotive use, backlighting etc.
Standard embossed tape packing: T11 (2000 pcs/reel)
8-mm tape reel
Unit: mm
Color and Material
Part Number
TLWLK1109
Color
White(Warm White)
Material
InGaN
JEDEC
JEITA
―
―
4-3W1
Absolute Maximum Ratings
(Ta
=
25°C)
Characteristics
Forward Current
Power Dissipation
Operating Temperature
Storage Temperature
(Note 1)
Symbol
I
F
P
D
T
opr
T
stg
Rating
50
200
−40
to 100
−40
to 100
Unit
mA
mW
°C
°C
TOSHIBA
Weight: 0.035 g (typ.)
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Forward current derating
I
F
– Ta
(mA)
I
F
Allowable forward current
80
60
40
20
0
0
20
40
60
80
100
120
Ambient temperature
Ta
(°C)
2009-10-13
For part availability and ordering information please call Toll Free: 800.984.5337
Website: www.marktechopto.com | Email: info@marktechopto.com
TLWLK1109(T11)
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Forward Voltage
Reverse Voltage
Symbol
V
F
V
R
Test condition
I
F
=
40 mA
I
R
=
1 mA
Min
3.0
⎯
Typ.
3.6
0.75
Max
4.0
⎯
Unit
V
V
Optical Characteristics
(Ta
=
25°C)
Characteristics
Chromaticity
Luminous Intensity
(Note 3)
Symbol
C
x
C
y
I
V
Test condition
I
F
=
40 mA
I
F
=
40 mA
I
F
=
40 mA
1600
Min
Typ.
(Note 2)
(Note 2)
2500
4000
Max
Unit
⎯
⎯
mcd
Note 2: The product is tested at the following chromaticity coordinate groups.
Test conditions: I
F
= 40 mA, Ta = 25 °C
Accuracy: +/-0.01
0.48
0.46
0.44
0.42
Cy
0.4
Point
1
2
3
4
Cx
0.430
0.410
0.460
0.485
Cy
0.420
0.380
0.395
0.440
0.38
0.36
0.34
0.36
0.38
0.4
0.42
Cx
0.44
0.46
0.48
0.5
Note 3: Iv rank classification
Test conditions: I
F
= 40 mA, Ta = 25 °C
Product name
TLWLK1109(T11)
XA1
XA2
YA1
Unit
Luminous intensity I
V
Min
1600
1600
2000
2500
Typ.
2500
⎯
⎯
⎯
mcd
Max
4000
2500
3200
4000
mA
40
I
F
The specification on the above table is used for Iv classification of LEDs in Toshiba facility.
Let the delivery ratio of each rank be unquestioned.
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2009-10-13
TLWLK1109(T11)
The cautions
When handling this LED, take the following measures to prevent the LED from being damaged or otherwise
adversely affected.
1) Use a conductive tablemat and conductive floor mat, and ground the workbench and floor.
2) Operators handling laser diodes must be grounded via a high resistance (about 1MΩ). A conductive strap is
good for this purpose.
3) Ground all tools including soldering irons.
This product is designed as a general display light source usage, and it has applied the measurement standard
that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application
(ex. Light source for sensor, optical communication and etc) except general display light source.
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2009-10-13
TLWLK1109(T11)
TLWLK1109
I
F
– V
F
100
Ta
=
25°C
(typ.)
3
I
V
/I
V
(40 mA) – I
F
I
V
/I
V
(40 mA)
(typ.)
Ta
=
25°C
(mA)
1
30
I
F
Forward Current
0.3
10
Luminous Intensity
2.6
3.0
3.4
3.8
4.2
4.6
5.0
0.1
3
0.03
1
2.2
0.01
1
3
5
10
30
50
100
300 500
Forward Voltage
V
F
(V)
Forward Current
I
F
(mA)
Relative I
V
– Tc
10
(typ.)
0.46
Cx, Cy – I
F
C
x
, C
y
(typ.)
Ta
=
25°C
Relative Luminous Intensity
0.44
C
x
Chromaticity Coordinate
0.42
1
0.40
C
y
0.38
0.1
-40
-20
0
20
40
60
80
100
0.36
0
10
20
30
40
50
Case Temperatue
Tc
(°C)
Forward Current
I
F
(mA)
Radiation pattern
(typ.)
Ta
=
25°C
1.0
Wavelength Characteristic
(typ.)
20°
30°
40°
50°
60°
70°
80°
90°
10°
0°
10°
Relative Luminous Intensity
20°
30°
40°
50°
60°
70°
80°
90
°
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
0
300
400
500
600
700
800
Wavelength
λ
(nm)
4
2009-10-13
TLWLK1109(T11)
Packaging
This LED device is packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture
absorption. The optical characteristics of the device may be affected by exposure to moisture in the air before
soldering and the device should therefore be stored under the following conditions:
1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
Temperature: 5°C to 30°C
Humidity: 90% (max)
2. After opening the moisture proof bag, the device should be assembled within 4week in an environment of 5°C
to 30°C/60% RH or below.
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
pink) or the expiration date has passed, the device should be baked in taping with reel.
After baking, use the baked device within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 24 to 48 hours.
Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
throw or drop the packed devices.
Mounting Method
Soldering
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Reflow soldering (example)
Temperature profile for Pb soldering (example)
10 s max
(*)
240°C max
Package surface
temperature (°C)
Temperature profile for Pb-free soldering (example)
5 s max
(*)
260°C max
Package surface
temperature (°C)
(*)
(*)
140~160°C max
(*)
4°C/s max
(*)
4°C/s max
(*)
max
(*)
150~180°C 230°C
4°C/s max
(*)
60~120 s max
(*)
Time
(s)
(*)
4°C/s max
max
(*)
60~120 s
Time
30~50s max
(*)
(s)
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The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than max(*) values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 4week of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Soldering iron : 25 W
Temperature : 300°C or less
Time
: within 3 s
Do not perform wave soldering.
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2009-10-13
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