SY88923KG datasheet, PDF - EEWORLD Datasheet

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SY88923KG: Description2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs; CategoryWireless rf/communication Telecom circuit; File Size100KB，6 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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SY88923KG Overview

2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs

SY88923KG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Microchip
package instruction	TSSOP,
Reach Compliance Code	compli
JESD-30 code	S-PDSO-G10
JESD-609 code	e4
length	3 mm
Humidity sensitivity level	1
Number of functions	1
Number of terminals	10
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Package shape	SQUARE
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.1 mm
Nominal supply voltage	5 V
surface mount	YES
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	3 mm

SY88923KG Related Products

	SY88923KG	SY88923	SY88923KCTR	SY88923KGTR	SY88923KC	SY88923_11
Description	2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs	2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs	2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs	2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs	2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs	2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs
Is it Rohs certified?	conform to	-	incompatible	conform to	incompatible	-
Maker	Microchip	-	Microchip	Microchip	Microchip	-
package instruction	TSSOP,	-	TSSOP, TSSOP10,.19,20	TSSOP,	TSSOP, TSSOP10,.19,20	-
Reach Compliance Code	compli	-	_compli	compli	_compli	-
JESD-30 code	S-PDSO-G10	-	S-PDSO-G10	S-PDSO-G10	S-PDSO-G10	-
JESD-609 code	e4	-	e0	e4	e0	-
length	3 mm	-	3 mm	3 mm	3 mm	-
Humidity sensitivity level	1	-	1	1	1	-
Number of functions	1	-	1	1	1	-
Number of terminals	10	-	10	10	10	-
Maximum operating temperature	85 °C	-	85 °C	85 °C	85 °C	-
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-40 °C	-
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSSOP	-	TSSOP	TSSOP	TSSOP	-
Package shape	SQUARE	-	SQUARE	SQUARE	SQUARE	-
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
Peak Reflow Temperature (Celsius)	260	-	240	260	240	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	1.1 mm	-	1.1 mm	1.1 mm	1.1 mm	-
Nominal supply voltage	5 V	-	5 V	5 V	5 V	-
surface mount	YES	-	YES	YES	YES	-
Telecom integrated circuit types	ATM/SONET/SDH SUPPORT CIRCUIT	-	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	ATM/SONET/SDH SUPPORT CIRCUIT	-
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-
Terminal surface	NICKEL PALLADIUM GOLD	-	Tin/Lead (Sn85Pb15)	NICKEL PALLADIUM GOLD	Tin/Lead (Sn85Pb15)	-
Terminal form	GULL WING	-	GULL WING	GULL WING	GULL WING	-
Terminal pitch	0.5 mm	-	0.5 mm	0.5 mm	0.5 mm	-
Terminal location	DUAL	-	DUAL	DUAL	DUAL	-
Maximum time at peak reflow temperature	40	-	30	40	30	-
width	3 mm	-	3 mm	3 mm	3 mm	-

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