|
SY88923KCTR |
SY88923 |
SY88923KGTR |
SY88923KC |
SY88923KG |
SY88923_11 |
Description |
2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs |
2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs |
2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs |
2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs |
2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs |
2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs |
Is it Rohs certified? |
incompatible |
- |
conform to |
incompatible |
conform to |
- |
Maker |
Microchip |
- |
Microchip |
Microchip |
Microchip |
- |
package instruction |
TSSOP, TSSOP10,.19,20 |
- |
TSSOP, |
TSSOP, TSSOP10,.19,20 |
TSSOP, |
- |
Reach Compliance Code |
_compli |
- |
compli |
_compli |
compli |
- |
JESD-30 code |
S-PDSO-G10 |
- |
S-PDSO-G10 |
S-PDSO-G10 |
S-PDSO-G10 |
- |
JESD-609 code |
e0 |
- |
e4 |
e0 |
e4 |
- |
length |
3 mm |
- |
3 mm |
3 mm |
3 mm |
- |
Humidity sensitivity level |
1 |
- |
1 |
1 |
1 |
- |
Number of functions |
1 |
- |
1 |
1 |
1 |
- |
Number of terminals |
10 |
- |
10 |
10 |
10 |
- |
Maximum operating temperature |
85 °C |
- |
85 °C |
85 °C |
85 °C |
- |
Minimum operating temperature |
-40 °C |
- |
-40 °C |
-40 °C |
-40 °C |
- |
Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
encapsulated code |
TSSOP |
- |
TSSOP |
TSSOP |
TSSOP |
- |
Package shape |
SQUARE |
- |
SQUARE |
SQUARE |
SQUARE |
- |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
- |
Peak Reflow Temperature (Celsius) |
240 |
- |
260 |
240 |
260 |
- |
Certification status |
Not Qualified |
- |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Maximum seat height |
1.1 mm |
- |
1.1 mm |
1.1 mm |
1.1 mm |
- |
Nominal supply voltage |
5 V |
- |
5 V |
5 V |
5 V |
- |
surface mount |
YES |
- |
YES |
YES |
YES |
- |
Telecom integrated circuit types |
ATM/SONET/SDH SUPPORT CIRCUIT |
- |
ATM/SONET/SDH SUPPORT CIRCUIT |
ATM/SONET/SDH SUPPORT CIRCUIT |
ATM/SONET/SDH SUPPORT CIRCUIT |
- |
Temperature level |
INDUSTRIAL |
- |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
- |
Terminal surface |
Tin/Lead (Sn85Pb15) |
- |
NICKEL PALLADIUM GOLD |
Tin/Lead (Sn85Pb15) |
NICKEL PALLADIUM GOLD |
- |
Terminal form |
GULL WING |
- |
GULL WING |
GULL WING |
GULL WING |
- |
Terminal pitch |
0.5 mm |
- |
0.5 mm |
0.5 mm |
0.5 mm |
- |
Terminal location |
DUAL |
- |
DUAL |
DUAL |
DUAL |
- |
Maximum time at peak reflow temperature |
30 |
- |
40 |
30 |
40 |
- |
width |
3 mm |
- |
3 mm |
3 mm |
3 mm |
- |