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SY88923KCTR

Description
2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs
CategoryWireless rf/communication    Telecom circuit   
File Size100KB,6 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Parametric Compare View All

SY88923KCTR Overview

2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs

SY88923KCTR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrochip
Parts packaging codeMSOP
package instructionTSSOP, TSSOP10,.19,20
Contacts10
Reach Compliance Code_compli
appSONET;SDH
JESD-30 codeS-PDSO-G10
JESD-609 codee0
length3 mm
Humidity sensitivity level1
Number of functions1
Number of terminals10
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP10,.19,20
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)240
power supply5 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum slew rate0.035 mA
Nominal supply voltage5 V
surface mountYES
technologyBIPOLAR
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn85Pb15)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width3 mm

SY88923KCTR Related Products

SY88923KCTR SY88923 SY88923KGTR SY88923KC SY88923KG SY88923_11
Description 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs 2.5Gbps HIGH-SPEED LIMITING POST AMPLIFIER Not recommended for new designs
Is it Rohs certified? incompatible - conform to incompatible conform to -
Maker Microchip - Microchip Microchip Microchip -
package instruction TSSOP, TSSOP10,.19,20 - TSSOP, TSSOP, TSSOP10,.19,20 TSSOP, -
Reach Compliance Code _compli - compli _compli compli -
JESD-30 code S-PDSO-G10 - S-PDSO-G10 S-PDSO-G10 S-PDSO-G10 -
JESD-609 code e0 - e4 e0 e4 -
length 3 mm - 3 mm 3 mm 3 mm -
Humidity sensitivity level 1 - 1 1 1 -
Number of functions 1 - 1 1 1 -
Number of terminals 10 - 10 10 10 -
Maximum operating temperature 85 °C - 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C - -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TSSOP - TSSOP TSSOP TSSOP -
Package shape SQUARE - SQUARE SQUARE SQUARE -
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH -
Peak Reflow Temperature (Celsius) 240 - 260 240 260 -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified -
Maximum seat height 1.1 mm - 1.1 mm 1.1 mm 1.1 mm -
Nominal supply voltage 5 V - 5 V 5 V 5 V -
surface mount YES - YES YES YES -
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT - ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT -
Temperature level INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn85Pb15) - NICKEL PALLADIUM GOLD Tin/Lead (Sn85Pb15) NICKEL PALLADIUM GOLD -
Terminal form GULL WING - GULL WING GULL WING GULL WING -
Terminal pitch 0.5 mm - 0.5 mm 0.5 mm 0.5 mm -
Terminal location DUAL - DUAL DUAL DUAL -
Maximum time at peak reflow temperature 30 - 40 30 40 -
width 3 mm - 3 mm 3 mm 3 mm -

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