GS8162Z36BD-200MT datasheet, PDF

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GS8162Z36BD-200MT: DescriptionZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165; Categorystorage storage; File Size482KB，33 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS8162Z36BD-200MT Overview

ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165

GS8162Z36BD-200MT Parametric

Parameter Name	Attribute value
Maker	GSI Technology
Parts packaging code	BGA
package instruction	13 X 15 MM, 1 MM PITCH, FPBGA-165
Contacts	165
Reach Compliance Code	unknown
ECCN code	3A991.B.2.B
Maximum access time	6.5 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY
JESD-30 code	R-PBGA-B165
length	15 mm
memory density	18874368 bit
Memory IC Type	ZBT SRAM
memory width	36
Number of functions	1
Number of terminals	165
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512KX36
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	13 mm

GS8162Z36BD-200MT Related Products

	GS8162Z36BD-200MT	GS8162Z18BB-200M	GS8162Z18BB-200MT	GS8162Z18BD-200M	GS8162Z18BD-200MT	GS8162Z36BB-200M	GS8162Z36BB-200MT	GS8162Z36BD-200M
Description	ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165	ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA119, FPBGA-119	ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA119, FPBGA-119	ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165	ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165	ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA119, FPBGA-119	ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA119, FPBGA-119	ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Maker	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology	GSI Technology
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	13 X 15 MM, 1 MM PITCH, FPBGA-165	BGA,	FPBGA-119	LBGA,	13 X 15 MM, 1 MM PITCH, FPBGA-165	BGA,	FPBGA-119	LBGA,
Contacts	165	119	119	165	165	119	119	165
Reach Compliance Code	unknown	compliant	unknown	compliant	compliant	compliant	unknown	compliant
ECCN code	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
Maximum access time	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns	6.5 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY	FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY
JESD-30 code	R-PBGA-B165	R-PBGA-B119	R-PBGA-B119	R-PBGA-B165	R-PBGA-B165	R-PBGA-B119	R-PBGA-B119	R-PBGA-B165
length	15 mm	22 mm	22 mm	15 mm	15 mm	22 mm	22 mm	15 mm
memory density	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM	ZBT SRAM
memory width	36	18	18	18	18	36	36	36
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	165	119	119	165	165	119	119	165
word count	524288 words	1048576 words	1048576 words	1048576 words	1048576 words	524288 words	524288 words	524288 words
character code	512000	1000000	1000000	1000000	1000000	512000	512000	512000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	512KX36	1MX18	1MX18	1MX18	1MX18	512KX36	512KX36	512KX36
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	BGA	BGA	LBGA	LBGA	BGA	BGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY	GRID ARRAY	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.4 mm	1.99 mm	1.99 mm	1.4 mm	1.4 mm	1.99 mm	1.99 mm	1.4 mm
Maximum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1.27 mm	1.27 mm	1 mm	1 mm	1.27 mm	1.27 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	13 mm	14 mm	14 mm	13 mm	13 mm	14 mm	14 mm	13 mm

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