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GS8162Z18BB-200MT

Description
ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA119, FPBGA-119
Categorystorage    storage   
File Size482KB,33 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Download Datasheet Parametric Compare View All

GS8162Z18BB-200MT Overview

ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA119, FPBGA-119

GS8162Z18BB-200MT Parametric

Parameter NameAttribute value
MakerGSI Technology
Parts packaging codeBGA
package instructionFPBGA-119
Contacts119
Reach Compliance Codeunknown
ECCN code3A991.B.2.B
Maximum access time6.5 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY
JESD-30 codeR-PBGA-B119
length22 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width18
Number of functions1
Number of terminals119
word count1048576 words
character code1000000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize1MX18
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.99 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width14 mm

GS8162Z18BB-200MT Related Products

GS8162Z18BB-200MT GS8162Z36BD-200MT GS8162Z18BB-200M GS8162Z18BD-200M GS8162Z18BD-200MT GS8162Z36BB-200M GS8162Z36BB-200MT GS8162Z36BD-200M
Description ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA119, FPBGA-119 ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA119, FPBGA-119 ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 ZBT SRAM, 1MX18, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA119, FPBGA-119 ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA119, FPBGA-119 ZBT SRAM, 512KX36, 6.5ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Maker GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology GSI Technology
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA
package instruction FPBGA-119 13 X 15 MM, 1 MM PITCH, FPBGA-165 BGA, LBGA, 13 X 15 MM, 1 MM PITCH, FPBGA-165 BGA, FPBGA-119 LBGA,
Contacts 119 165 119 165 165 119 119 165
Reach Compliance Code unknown unknown compliant compliant compliant compliant unknown compliant
ECCN code 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
Maximum access time 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns 6.5 ns
Other features FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY
JESD-30 code R-PBGA-B119 R-PBGA-B165 R-PBGA-B119 R-PBGA-B165 R-PBGA-B165 R-PBGA-B119 R-PBGA-B119 R-PBGA-B165
length 22 mm 15 mm 22 mm 15 mm 15 mm 22 mm 22 mm 15 mm
memory density 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 18 36 18 18 18 36 36 36
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 119 165 119 165 165 119 119 165
word count 1048576 words 524288 words 1048576 words 1048576 words 1048576 words 524288 words 524288 words 524288 words
character code 1000000 512000 1000000 1000000 1000000 512000 512000 512000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 1MX18 512KX36 1MX18 1MX18 1MX18 512KX36 512KX36 512KX36
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA LBGA BGA LBGA LBGA BGA BGA LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.99 mm 1.4 mm 1.99 mm 1.4 mm 1.4 mm 1.99 mm 1.99 mm 1.4 mm
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1.27 mm 1 mm 1.27 mm 1 mm 1 mm 1.27 mm 1.27 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
width 14 mm 13 mm 14 mm 13 mm 13 mm 14 mm 14 mm 13 mm

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