MCP2155-I/PRVB datasheet, PDF - EEWORLD Datasheet

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MCP2155-I/PRVB: DescriptionIrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 18-PDIP, TUBE; CategoryWireless rf/communication Telecom circuit; File Size532KB，52 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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MCP2155-I/PRVB Overview

IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 18-PDIP, TUBE

MCP2155-I/PRVB Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Maker	Microchip
package instruction	DIP,
Reach Compliance Code	compliant
JESD-30 code	R-PDIP-T18
length	22.8 mm
Number of functions	1
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Filter level	TS 16949
Maximum seat height	4.32 mm
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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MCP2155-I/PRVB Related Products

	MCP2155-I/PRVB	MCP2155-I/SORVB	MCP2155T-I/SSG	MCP2155-I/SSG	MCP2155T-I/SORVB	MCP2155T-I/SSRVB	MCP2155-I/SSRVB
Description	IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 18-PDIP, TUBE	IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, TUBE	SPECIALTY TELECOM CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20	SPECIALTY TELECOM CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20	IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, T/R	IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 20-SSOP 208mil, T/R	IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 20-SSOP 208mil, TUBE
Is it lead-free?	Contains lead	Contains lead	Lead free	Lead free	Lead free	Contains lead	Contains lead
Maker	Microchip	Microchip	Microchip	Microchip	Microchip	Microchip	Microchip
package instruction	DIP,	SOP,	0.209 INCH, PLASTIC, SSOP-20	0.209 INCH, PLASTIC, SSOP-20	SOIC-18	SSOP-20	SSOP-20
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
JESD-30 code	R-PDIP-T18	R-PDSO-G18	R-PDSO-G20	R-PDSO-G20	R-PDSO-G18	R-PDSO-G20	R-PDSO-G20
length	22.8 mm	11.55 mm	7.2 mm	7.2 mm	11.55 mm	7.2 mm	7.2 mm
Number of functions	1	1	1	1	1	1	1
Number of terminals	18	18	20	20	18	20	20
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SSOP	SSOP	SOP	SSOP	SSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Maximum seat height	4.32 mm	2.65 mm	2 mm	2 mm	2.65 mm	2 mm	2 mm
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.62 mm	7.5 mm	5.3 mm	5.3 mm	7.5 mm	5.3 mm	5.3 mm
Filter level	TS 16949	TS 16949	-	-	TS 16949	TS 16949	TS 16949

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