IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, T/R
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Maker | Microchip |
package instruction | SOIC-18 |
Reach Compliance Code | compliant |
JESD-30 code | R-PDSO-G18 |
length | 11.55 mm |
Number of functions | 1 |
Number of terminals | 18 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Filter level | TS 16949 |
Maximum seat height | 2.65 mm |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
width | 7.5 mm |
MCP2155T-I/SORVB | MCP2155-I/PRVB | MCP2155-I/SORVB | MCP2155T-I/SSG | MCP2155-I/SSG | MCP2155T-I/SSRVB | MCP2155-I/SSRVB | |
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Description | IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, T/R | IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 18-PDIP, TUBE | IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, TUBE | SPECIALTY TELECOM CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20 | SPECIALTY TELECOM CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20 | IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 20-SSOP 208mil, T/R | IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 20-SSOP 208mil, TUBE |
Is it lead-free? | Lead free | Contains lead | Contains lead | Lead free | Lead free | Contains lead | Contains lead |
Maker | Microchip | Microchip | Microchip | Microchip | Microchip | Microchip | Microchip |
package instruction | SOIC-18 | DIP, | SOP, | 0.209 INCH, PLASTIC, SSOP-20 | 0.209 INCH, PLASTIC, SSOP-20 | SSOP-20 | SSOP-20 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
JESD-30 code | R-PDSO-G18 | R-PDIP-T18 | R-PDSO-G18 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
length | 11.55 mm | 22.8 mm | 11.55 mm | 7.2 mm | 7.2 mm | 7.2 mm | 7.2 mm |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 18 | 18 | 18 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | SOP | SSOP | SSOP | SSOP | SSOP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
Maximum seat height | 2.65 mm | 4.32 mm | 2.65 mm | 2 mm | 2 mm | 2 mm | 2 mm |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Telecom integrated circuit types | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 7.5 mm | 7.62 mm | 7.5 mm | 5.3 mm | 5.3 mm | 5.3 mm | 5.3 mm |
Filter level | TS 16949 | TS 16949 | TS 16949 | - | - | TS 16949 | TS 16949 |