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MCP2155T-I/SORVB

Description
IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, T/R
CategoryWireless rf/communication    Telecom circuit   
File Size532KB,52 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance  
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MCP2155T-I/SORVB Overview

IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, T/R

MCP2155T-I/SORVB Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerMicrochip
package instructionSOIC-18
Reach Compliance Codecompliant
JESD-30 codeR-PDSO-G18
length11.55 mm
Number of functions1
Number of terminals18
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Filter levelTS 16949
Maximum seat height2.65 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm

MCP2155T-I/SORVB Related Products

MCP2155T-I/SORVB MCP2155-I/PRVB MCP2155-I/SORVB MCP2155T-I/SSG MCP2155-I/SSG MCP2155T-I/SSRVB MCP2155-I/SSRVB
Description IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, T/R IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 18-PDIP, TUBE IrDA. protocol handler plus endec for DCE Apps, -40C to +85C, 18-SOIC 300mil, TUBE SPECIALTY TELECOM CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20 SPECIALTY TELECOM CIRCUIT, PDSO20, 0.209 INCH, PLASTIC, SSOP-20 IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 20-SSOP 208mil, T/R IrDA. protocol handler plus endec for DTE Apps, -40C to +85C, 20-SSOP 208mil, TUBE
Is it lead-free? Lead free Contains lead Contains lead Lead free Lead free Contains lead Contains lead
Maker Microchip Microchip Microchip Microchip Microchip Microchip Microchip
package instruction SOIC-18 DIP, SOP, 0.209 INCH, PLASTIC, SSOP-20 0.209 INCH, PLASTIC, SSOP-20 SSOP-20 SSOP-20
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
JESD-30 code R-PDSO-G18 R-PDIP-T18 R-PDSO-G18 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
length 11.55 mm 22.8 mm 11.55 mm 7.2 mm 7.2 mm 7.2 mm 7.2 mm
Number of functions 1 1 1 1 1 1 1
Number of terminals 18 18 18 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP SSOP SSOP SSOP SSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Maximum seat height 2.65 mm 4.32 mm 2.65 mm 2 mm 2 mm 2 mm 2 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 7.5 mm 7.62 mm 7.5 mm 5.3 mm 5.3 mm 5.3 mm 5.3 mm
Filter level TS 16949 TS 16949 TS 16949 - - TS 16949 TS 16949

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