|
MAX7652CCB-TD |
MAX7652ECB-TD |
MAX7651ECB-D |
MAX7651ECB-TD |
MAX7651CCB-TD |
MAX7651CCB-D |
MAX7652ECB-D |
Description |
Analog Circuit, 1 Func, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Analog Circuit, 1 Func, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Analog Circuit, 1 Func, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Analog Circuit, 1 Func, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Analog Circuit, 1 Func, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Analog Circuit, 1 Func, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Analog Circuit, 1 Func, CMOS, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Parts packaging code |
QFP |
QFP |
QFP |
QFP |
QFP |
QFP |
QFP |
package instruction |
10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
10 X 10 MM, 1.40 MM HEIGHT, MO-136BJ, TQFP-64 |
Contacts |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
Analog Integrated Circuits - Other Types |
ANALOG CIRCUIT |
ANALOG CIRCUIT |
ANALOG CIRCUIT |
ANALOG CIRCUIT |
ANALOG CIRCUIT |
ANALOG CIRCUIT |
ANALOG CIRCUIT |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
length |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
3 |
3 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
64 |
64 |
64 |
64 |
64 |
64 |
64 |
Maximum operating temperature |
70 °C |
85 °C |
85 °C |
85 °C |
70 °C |
70 °C |
85 °C |
Minimum operating temperature |
- |
-40 °C |
-40 °C |
-40 °C |
- |
- |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFQFP |
LFQFP |
LFQFP |
LFQFP |
LFQFP |
LFQFP |
LFQFP |
Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) |
240 |
240 |
245 |
240 |
240 |
245 |
245 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.6 mm |
1.6 mm |
1.6 mm |
1.6 mm |
1.6 mm |
1.6 mm |
1.6 mm |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
3.6 V |
Minimum supply voltage (Vsup) |
2.7 V |
2.7 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
2.7 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
5 V |
5 V |
5 V |
5 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |
10 mm |