HY62SF16804B-SF70C datasheet, PDF

HY62SF16804B-SF70C: DescriptionStandard SRAM, 512KX16, 70ns, CMOS, PBGA48, FBGA-48; Categorystorage storage; File Size157KB，10 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/

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HY62SF16804B-SF70C Overview

Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, FBGA-48

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SK Hynix
Parts packaging code	BGA
package instruction	TFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	70 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
length	8.5 mm
memory density	8388608 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/2 V
Certification status	Not Qualified
Maximum seat height	1.1 mm
Minimum standby current	1.2 V
Maximum slew rate	0.015 mA
Maximum supply voltage (Vsup)	2.3 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6 mm

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