MC2045-2YWAFER datasheet, PDF - EEWORLD Datasheet

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MC2045-2YWAFER: DescriptionTelecom Circuit, 1-Func, BICMOS, WAFER; CategoryWireless rf/communication Telecom circuit; File Size399KB，19 Pages; ManufacturerMindspeed Technologies Inc; Websitehttps://www.macom.com

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MC2045-2YWAFER Overview

Telecom Circuit, 1-Func, BICMOS, WAFER

MC2045-2YWAFER Parametric

Parameter Name	Attribute value
Maker	Mindspeed Technologies Inc
Parts packaging code	WAFER
package instruction	DIE,
Reach Compliance Code	compliant
JESD-30 code	X-XUUC-N
Number of functions	1
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Certification status	Not Qualified
Nominal supply voltage	3.3 V
surface mount	YES
technology	BICMOS
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER

MC2045-2YWAFER Related Products

	MC2045-2YWAFER	MC2045-2YDIEWP	MC2045-2Y-06-T	MC2045-2YQ16	MC2045-2YS16	MC2045-2YT20
Description	Telecom Circuit, 1-Func, BICMOS, WAFER	Telecom Circuit, 1-Func, BICMOS, DIE-20	SPECIALTY TELECOM CIRCUIT, BCC16, BCC-16	Telecom Circuit, 1-Func, BICMOS, PDSO16, QSOP-16	Telecom Circuit, 1-Func, BICMOS, PDSO16, SOIC-16	Telecom Circuit, 1-Func, BICMOS, PDSO20, TSSOP-20
Maker	Mindspeed Technologies Inc	Mindspeed Technologies Inc	Mindspeed Technologies Inc	Mindspeed Technologies Inc	Mindspeed Technologies Inc	Mindspeed Technologies Inc
Parts packaging code	WAFER	DIE	BCC	SOIC	SOIC	TSSOP
package instruction	DIE,	DIE,	VBCC,	LSSOP,	LSOP,	TSSOP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
JESD-30 code	X-XUUC-N	R-XUUC-N20	S-XBCC-B16	R-PDSO-G16	R-PDSO-G16	R-PDSO-G20
Number of functions	1	1	1	1	1	1
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIE	DIE	VBCC	LSSOP	LSOP	TSSOP
Package shape	UNSPECIFIED	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	UNCASED CHIP	CHIP CARRIER, VERY THIN PROFILE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	BUTT	GULL WING	GULL WING	GULL WING
Terminal location	UPPER	UPPER	BOTTOM	DUAL	DUAL	DUAL
Contacts	-	20	16	16	16	20
Number of terminals	-	20	16	16	16	20
Is it Rohs certified?	-	-	incompatible	incompatible	incompatible	incompatible
length	-	-	4 mm	4.9 mm	9.9 mm	6.5 mm
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	240	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	-	-	0.8 mm	1.6 mm	1.7 mm	1.2 mm
Terminal pitch	-	-	0.8 mm	0.65 mm	1.27 mm	0.65 mm
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	30	NOT SPECIFIED	NOT SPECIFIED

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