AS6VA5128-STC datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> AS6VA5128-STC

AS6VA5128-STC: DescriptionStandard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32; Categorystorage storage; File Size199KB，11 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

Download Datasheet Parametric Compare View All

AS6VA5128-STC Overview

Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32

AS6VA5128-STC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	TSOP1
package instruction	TSOP1,
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	55 ns
JESD-30 code	R-PDSO-G32
length	11.8 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
width	8 mm

Preview

Download Datasheet

View All

June 2000

AS6VA5128

2.7V to 3.3V 512K × 8 Intelliwatt™ low-power CMOS SRAM with one chip enable

Features

• AS6VA5128

• Intelliwatt™ active power circuitry

• Industrial and commercial temperature ranges available

• Organization: 524,288 words × 8 bits

• 2.7V to 3.3V at 55 ns

• Low power consumption: ACTIVE

- 132 mW at 3.3V and 55 ns

• Easy memory expansion with CS, OE inputs

• Smallest footprint packages

36(48)-ball FBGA

32-pin TSOP I (available September 2000)

32-pin sTSOP I (available September 2000)

32-pin TSOP II (forward) (available September 2000)

32-pin TSOP II (reverse) (available September 2000)

• Low power consumption: STANDBY

- 66

W max at 3.3V

• ESD protection

≥

2000 volts

• Latch-up current

≥

200 mA

• 1.2V data retention

• Equal access and cycle times

Logic block diagram

GND

Input buffer

I/O8

Sense amp

Pin arrangement

A18

A16

A14

A12

I/O1

I/O2

I/O3

A15

A17

A13

A11

A10

I/O8

I/O7

I/O6

I/O5

I/O4

A15

A17

A13

A11

A10

I/O8

I/O7

I/O6

I/O5

I/O4

A18

A16

A14

A12

I/O1

I/O2

I/O3

Row decoder

512K

Array

(4,194,304)

32-pin TSOPII

(Forward)

32-pin TSOPII

(Reverse)

I/O1

Column decoder

A10

A11

A12

A13

A14

A15

A16

Control

circuit

48-CSP BGA Package

(shading indicates no ball)

I/O

A11

A13

A17

A15

A18

A16

A14

A12

32-pin TSOPII

32-pin sTSOPI

(Forward)

A10

I/O8

I/O7

I/O6

I/O5

I/O4

I/O3

I/O2

I/O1

Selection guide

Range

Product

AS6VA5128

Min

(V)

2.7

Typ

(V)

3.0

Max

(V)

3.3

Speed

(ns)

Power Dissipation

Operating (I

CC1

)

Standby (I

SB2

)

Max (mA)

Max (

7/14/00

ALLIANCE SEMICONDUCTOR

AS6VA5128-STC Related Products

	AS6VA5128-STC	AS6VA5128-HRC	AS6VA5128-TC	AS6VA5128-HRI	AS6VA5128-TI	AS6VA5128-HFC	AS6VA5128-HFI	AS6VA5128-STI
Description	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, REVERSE, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, REVERSE, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	TSOP1	TSOP2	TSOP1	TSOP2	TSOP1	TSOP2	TSOP2	TSOP1
package instruction	TSOP1,	TSOP2-R,	TSOP1,	TSOP2-R,	TSOP1,	TSOP2,	TSOP2,	TSOP1,
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
length	11.8 mm	20.95 mm	18.4 mm	20.95 mm	18.4 mm	20.95 mm	20.95 mm	11.8 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C	85 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP2-R	TSOP1	TSOP2-R	TSOP1	TSOP2	TSOP2	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	1.27 mm	0.5 mm	1.27 mm	0.5 mm	1.27 mm	1.27 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	8 mm	10.16 mm	8 mm	10.16 mm	8 mm	10.16 mm	10.16 mm	8 mm

Recommended Resources

Suitable for DC converter circuit diagram in multimeter b

Temperature difference measurement circuit

Reactive stepper motor PWM speed regulation circuit

Capacitor step-down power supply circuit and capacitor selection and precautions

810E computer motherboard circuit diagram_22

MP3 hardware circuit schematic diagram 09

Share: Regarding the 2021 eSports race, you must be familiar with these!: [i=s]This post was last edited by Jacktang on 2021-8-22 13:18[/i]...; Jacktang Electronics Design Contest

Conversion from C to VHDL in SOC system.rar: Conversion from C to VHDL in SOC system.rar...; zxopenljx EE_FPGA Learning Park

Learn knowledge and win gifts | Tektronix Semiconductor Materials and Device Test Technology Power Characteristics!: Power semiconductor devices are at the core of modern power electronic converters, and they play a very important role in the reliability, cost and performance of the device. Power semiconductor devic...; EEWORLD社区 Power technology

EEWORLD University Hall----TI Robot System Learning Kit (TI-RSLK) Upgraded Version: TI Robotics System Learning Kit (TI-RSLK) Upgraded Version : https://training.eeworld.com.cn/course/5630...; hi5 Integrated technical exchanges

Problems with CPLD driving MAX7219: I used CPLD to drive the MAX7219 digital tube display and successfully transmitted 16-bit parameters.However, the transmission of 8-bit parameters is unsuccessful. The code is as follows: module MAX72...; chenbingjy EE_FPGA Learning Park

This Friday, TTI&TE will broadcast live: the development and latest applications of sensors in industrial motors. Make an appointment now to get 2 chances to win a prize draw.: Live broadcast time: September 6 (Friday) 10:00-11:30 Live Topic: The Development and Latest Application of Sensors in Industrial Motors Live Broadcast Introduction: How much impact will the aging of ...; EEWORLD社区 Sensor

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components