AS6VA5128-STI datasheet, PDF - EEWORLD Datasheet

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AS6VA5128-STI: DescriptionStandard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32; Categorystorage storage; File Size199KB，11 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS6VA5128-STI Overview

Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32

AS6VA5128-STI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	TSOP1
package instruction	TSOP1,
Contacts	32
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	55 ns
JESD-30 code	R-PDSO-G32
length	11.8 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
width	8 mm

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June 2000

AS6VA5128

2.7V to 3.3V 512K × 8 Intelliwatt™ low-power CMOS SRAM with one chip enable

Features

• AS6VA5128

• Intelliwatt™ active power circuitry

• Industrial and commercial temperature ranges available

• Organization: 524,288 words × 8 bits

• 2.7V to 3.3V at 55 ns

• Low power consumption: ACTIVE

- 132 mW at 3.3V and 55 ns

• Easy memory expansion with CS, OE inputs

• Smallest footprint packages

36(48)-ball FBGA

32-pin TSOP I (available September 2000)

32-pin sTSOP I (available September 2000)

32-pin TSOP II (forward) (available September 2000)

32-pin TSOP II (reverse) (available September 2000)

• Low power consumption: STANDBY

- 66

W max at 3.3V

• ESD protection

≥

2000 volts

• Latch-up current

≥

200 mA

• 1.2V data retention

• Equal access and cycle times

Logic block diagram

GND

Input buffer

I/O8

Sense amp

Pin arrangement

A18

A16

A14

A12

I/O1

I/O2

I/O3

A15

A17

A13

A11

A10

I/O8

I/O7

I/O6

I/O5

I/O4

A15

A17

A13

A11

A10

I/O8

I/O7

I/O6

I/O5

I/O4

A18

A16

A14

A12

I/O1

I/O2

I/O3

Row decoder

512K

Array

(4,194,304)

32-pin TSOPII

(Forward)

32-pin TSOPII

(Reverse)

I/O1

Column decoder

A10

A11

A12

A13

A14

A15

A16

Control

circuit

48-CSP BGA Package

(shading indicates no ball)

I/O

A11

A13

A17

A15

A18

A16

A14

A12

32-pin TSOPII

32-pin sTSOPI

(Forward)

A10

I/O8

I/O7

I/O6

I/O5

I/O4

I/O3

I/O2

I/O1

Selection guide

Range

Product

AS6VA5128

Min

(V)

2.7

Typ

(V)

3.0

Max

(V)

3.3

Speed

(ns)

Power Dissipation

Operating (I

CC1

)

Standby (I

SB2

)

Max (mA)

Max (

7/14/00

ALLIANCE SEMICONDUCTOR

AS6VA5128-STI Related Products

	AS6VA5128-STI	AS6VA5128-HRC	AS6VA5128-TC	AS6VA5128-HRI	AS6VA5128-TI	AS6VA5128-HFC	AS6VA5128-HFI	AS6VA5128-STC
Description	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, REVERSE, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, REVERSE, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, TSOP2-32	Standard SRAM, 512KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, TSOP1-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	TSOP1	TSOP2	TSOP1	TSOP2	TSOP1	TSOP2	TSOP2	TSOP1
package instruction	TSOP1,	TSOP2-R,	TSOP1,	TSOP2-R,	TSOP1,	TSOP2,	TSOP2,	TSOP1,
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
length	11.8 mm	20.95 mm	18.4 mm	20.95 mm	18.4 mm	20.95 mm	20.95 mm	11.8 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	TSOP2-R	TSOP1	TSOP2-R	TSOP1	TSOP2	TSOP2	TSOP1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	1.27 mm	0.5 mm	1.27 mm	0.5 mm	1.27 mm	1.27 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	8 mm	10.16 mm	8 mm	10.16 mm	8 mm	10.16 mm	10.16 mm	8 mm

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