05221
Only One Name Means ProTek’Tion™
ULLC0408FC05C
UnbUmPed Low CaPaCitanCe FLiP ChiP tvs aRRay
desCRiPtion
The ULLC0408FC05C Flip Chip employs advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. This low capacitance device is ideally suited for handheld devices, PCMCIA and SMART cards.
The ULLC0408FC05C provides ESD protection greater than 25 kilovolts and features superior clamping performance, low leakage current characteristics and a response
time of less than a nanosecond. The low inductance virtually eliminates overshoot voltage due to package inductance.
FeatURes
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Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Low ESD Overshoot Voltage
Bidirectional Configuration & Monolithic Structure
Protects 4 Isolated Lines
Low Capacitance: 6pF
Low Leakage Current
RoHS Compliant
REACH Compliant
aPPLiCations
• Cellular Phones
• Portable Electronics
• SMART Cards
meChaniCaL ChaRaCteRistiCs
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Standard EIA Chip Size: 0408
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Pin ConFiGURation
05221.R2 3/11
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05221
Only One Name Means ProTek’Tion™
ULLC0408FC05C
tyPiCaL deviCe ChaRaCteRistiCs
maXimUm RatinGs
@ 25°C Unless otherwise specified
PaRameteR
Operating Temperature
Storage Temperature
symboL
T
A
T
STG
vaLUe
-55 to 150
-55 to 150
Units
°C
°C
eLeCtRiCaL ChaRaCteRistiCs PeR Line
@ 25°C Unless otherwise specified
PaRt
nUmbeR
(note 1)
Rated
stand-oFF
voLtaGe
v
wm
voLts
ULLC0408FC05C
1. Device is bidirectional.
minimUm
bReaKdown
voLtaGe
@ 1ma
v
(bR)
voLts
6.0
maXimUm
LeaKaGe
CURRent
@v
wm
i
d
µa
5.0
tyPiCaL
CaPaCitanCe
@0v, 1mhz
C
pF
6
5.0
notes
05221.R2 3/11
Page 2
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05221
Only One Name Means ProTek’Tion™
ULLC0408FC05C
tyPiCaL deviCe ChaRaCteRistiCs
FiGURe 1
oveRshoot & CLamPinG voLtaGe
35
5 volts per division
25
15
5
-5
esd test Pulse - 25 kilovolt, 1/30ns (waveshape)
FiGURe 2
CaPaCitanCe vs ReveRse voLtaGe
8
Cj - Capactiance - pF
4
0
0
2
4
v
R
- Reverse voltage - volts
6
05221.R2 3/11
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05221
Only One Name Means ProTek’Tion™
ULLC0408FC05C
soLdeR ReFLow inFoRmation
PRinted CiRCUit boaRd ReCommendations
PaRameteR
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity (Only applies to bumped devices)
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP (Entek Cu Plus 106A)
±50µm
±20µm
60 seconds
270°C
vaLUe
ReqUiRements
Temperature:
T
P
for Lead-Free (Sn/Ag/Cu): 260-270°C
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.
ReCommended non-soLdeR masK
deFined Pad iLLUstRation
non-solder mask defined Pad
0.275mm dia.
solder mask opening
0.325mm dia.
solder stencil opening
0.330mm dia.
maximum solder Reflow
(35-53°C above maximum solder melt temp)
t
P
temperature - °C
Ramp-Up
solder melt
(maximum temp)
Ramp-down
Preheat
(stay below Flux activation temp)
30-60 seconds
Ramp-Up
15 seconds
(minimize)
Page 4
solder-time
15-20 seconds
Ramp-down
05221.R2 3/11
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05221
Only One Name Means ProTek’Tion™
ULLC0408FC05C
U0408 PaCKaGe inFoRmation
oUtLine dimensions
dim
A
B
C
E
F
I
notes
1.97
0.406
0.98
0.15 SQ
2.03
miLLimeteRs
min
0.56
0.86
1.02
inChes
min
0.022
0.034
0.038
0.078
0.016
0.040
0.080
0.006 SQ
maX
maX
1. Controlling dimensions in inches.
2. Decimal tolerance: .xxx ± 0.05mm (0.002”).
TOP
A
B C
SIDE
F
E
Metalized Die Contacts
END
I
05221.R2 3/11
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