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MLL751A-TP

Description
Zener Diode, 5.1V V(Z), 5%, 0.5W, Silicon, Unidirectional, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size463KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance  
Download Datasheet Parametric View All

MLL751A-TP Overview

Zener Diode, 5.1V V(Z), 5%, 0.5W, Silicon, Unidirectional, MINIMELF-2

MLL751A-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Parts packaging codeMELF
package instructionMINIMELF-2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeO-LELF-R2
JESD-609 codee3
Number of components1
Number of terminals2
Maximum operating temperature200 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage5.1 V
surface mountYES
technologyZENER
Terminal surfaceMATTE TIN
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current20 mA
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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MLL746
THRU
MLL759
Features
Zener Voltage 3.3V to 12V
Silicon Planar Power Zener Diodes
Standards zener voltage tolerance is ±10% , Add suffix “A” for
±5% tolerance, other tolerances are available upon request
0.5W Silicon Planar
Zener Diodes
Maximum Ratings
Symbol
Zener Current
Power Dissipation
@ T
A
=50
o
C
Junction Temperature
Storage Temperature
Range
P
tot
T
J
T
STG
Value
See Table 1
500
200
-65 to 200
Units
mW
o
MiniMELF
Cathode Ma
C
C
B
A
C
o
Electrical Characteristics @ 25°C Unless Otherwise Specified
Symbol
Thermal resistance
Forward Voltage
@ I
F
=200mA
R
q
JA
Maximum
300
1.5
Unit
o
C/W
V
DIMENSIONS
INCHES
MIN
.134
.008
.055
MM
MIN
3.40
.20
1.40
V
F
DIM
A
B
C
MAX
.142
.016
.059
MAX
3.60
.40
1.50
NOTE
NOTE:
1) Valid provided that a distance of 8mm from case are kept
at ambient temperature
2) Power derating: 4.0mW/
o
C above 50
o
C
SUGGESTED SOLDER
PAD LAYOUT
.165
.075
.030
Revision: 2
www.mccsemi.com
1
of
3
2008/01/01

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