MT8840AE datasheet, PDF - EEWORLD Datasheet

MT8840AE: DescriptionModem, 2kbps Data, CMOS, PDIP18; CategoryWireless rf/communication Telecom circuit; File Size600KB，11 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MT8840AE Overview

Modem, 2kbps Data, CMOS, PDIP18

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
Other features	FULL DUPLEX
data rate	2 Mbps
JESD-30 code	R-PDIP-T18
JESD-609 code	e0
Number of functions	1
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	5 mA
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	MT8840AE	MT8840AS
Description	Modem, 2kbps Data, CMOS, PDIP18	Modem, 2kbps Data, CMOS, PDSO18
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	Microsemi	Microsemi
Parts packaging code	DIP	SOIC
package instruction	DIP, DIP18,.3	SOP, SOP18,.4
Contacts	18	18
Reach Compliance Code	unknown	unknown
Other features	FULL DUPLEX	FULL DUPLEX
data rate	2 Mbps	2 Mbps
JESD-30 code	R-PDIP-T18	R-PDSO-G18
JESD-609 code	e0	e0
Number of functions	1	1
Number of terminals	18	18
Maximum operating temperature	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP
Encapsulate equivalent code	DIP18,.3	SOP18,.4
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	5 mA	5 mA
Nominal supply voltage	5 V	5 V
surface mount	NO	YES
technology	CMOS	CMOS
Telecom integrated circuit types	MODEM	MODEM
Temperature level	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL

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