MT8840AS datasheet, PDF - EEWORLD Datasheet

MT8840AS: DescriptionModem, 2kbps Data, CMOS, PDSO18; CategoryWireless rf/communication Telecom circuit; File Size600KB，11 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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MT8840AS Overview

Modem, 2kbps Data, CMOS, PDSO18

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	SOIC
package instruction	SOP, SOP18,.4
Contacts	18
Reach Compliance Code	unknown
Other features	FULL DUPLEX
data rate	2 Mbps
JESD-30 code	R-PDSO-G18
JESD-609 code	e0
Number of functions	1
Number of terminals	18
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP18,.4
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	5 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL

	MT8840AS	MT8840AE
Description	Modem, 2kbps Data, CMOS, PDSO18	Modem, 2kbps Data, CMOS, PDIP18
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	Microsemi	Microsemi
Parts packaging code	SOIC	DIP
package instruction	SOP, SOP18,.4	DIP, DIP18,.3
Contacts	18	18
Reach Compliance Code	unknown	unknown
Other features	FULL DUPLEX	FULL DUPLEX
data rate	2 Mbps	2 Mbps
JESD-30 code	R-PDSO-G18	R-PDIP-T18
JESD-609 code	e0	e0
Number of functions	1	1
Number of terminals	18	18
Maximum operating temperature	85 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP
Encapsulate equivalent code	SOP18,.4	DIP18,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum slew rate	5 mA	5 mA
Nominal supply voltage	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Telecom integrated circuit types	MODEM	MODEM
Temperature level	OTHER	OTHER
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL

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