MB84VF5F5F5J2-70PBS datasheet, PDF

MB84VF5F5F5J2-70PBS: DescriptionMemory Circuit, 4MX16, CMOS, PBGA107, PLASTIC, FBGA-107; Categorystorage storage; File Size886KB，60 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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MB84VF5F5F5J2-70PBS Overview

Memory Circuit, 4MX16, CMOS, PBGA107, PLASTIC, FBGA-107

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	107
Reach Compliance Code	compliant
Other features	MOBILE FCRAM IS ORGANISED AS 4M X 16
JESD-30 code	R-PBGA-B107
JESD-609 code	e0
length	10 mm
memory density	67108864 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	107
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-30 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.1 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	9 mm

	MB84VF5F5F5J2-70PBS	MB84VF5F5F5J2-70PBS-E1
Description	Memory Circuit, 4MX16, CMOS, PBGA107, PLASTIC, FBGA-107	Memory Circuit, 4MX16, CMOS, PBGA107, PLASTIC, FBGA-107
Is it Rohs certified?	incompatible	conform to
Maker	SPANSION	SPANSION
Parts packaging code	BGA	BGA
package instruction	LFBGA,	LFBGA,
Contacts	107	107
Reach Compliance Code	compliant	compliant
Other features	MOBILE FCRAM IS ORGANISED AS 4M X 16	MOBILE FCRAM IS ORGANISED AS 4M X 16
JESD-30 code	R-PBGA-B107	R-PBGA-B107
JESD-609 code	e0	e1
length	10 mm	10 mm
memory density	67108864 bit	67108864 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16
Number of functions	1	1
Number of terminals	107	107
word count	4194304 words	4194304 words
character code	4000000	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-30 °C	-30 °C
organize	4MX16	4MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	240	260
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	3.1 V	3.1 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal surface	TIN LEAD	TIN SILVER COPPER
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	40
width	9 mm	9 mm

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