Audio Amplifier, 0.65W, 1 Channel(s), 1 Func, Bipolar, PDIP8, DIP-8
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | DIP |
| package instruction | DIP, DIP8,.3 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| harmonic distortion | 10% |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| length | 9.2 mm |
| Number of channels | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -20 °C |
| Nominal output power | 0.65 W |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.55 mm |
| Maximum slew rate | 8 mA |
| Maximum supply voltage (Vsup) | 12 V |
| Minimum supply voltage (Vsup) | 4 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| LM386N | LM386D | LM386G | |
|---|---|---|---|
| Description | Audio Amplifier, 0.65W, 1 Channel(s), 1 Func, Bipolar, PDIP8, DIP-8 | Audio Amplifier, 0.65W, 1 Channel(s), 1 Func, Bipolar, PDSO8, SOP-8 | Audio Amplifier, 0.65W, 1 Channel(s), 1 Func, Bipolar |
| Maker | SAMSUNG | SAMSUNG | SAMSUNG |
| package instruction | DIP, DIP8,.3 | SOP, SOP8,.25 | , DIE OR CHIP |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| harmonic distortion | 10% | 10% | 10% |
| Number of channels | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| Minimum operating temperature | -20 °C | -20 °C | -20 °C |
| Nominal output power | 0.65 W | 0.65 W | 0.65 W |
| Encapsulate equivalent code | DIP8,.3 | SOP8,.25 | DIE OR CHIP |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 8 mA | 8 mA | 8 mA |
| technology | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Is it Rohs certified? | incompatible | incompatible | - |
| Parts packaging code | DIP | SOIC | - |
| Contacts | 8 | 8 | - |
| JESD-30 code | R-PDIP-T8 | R-PDSO-G8 | - |
| JESD-609 code | e0 | e0 | - |
| length | 9.2 mm | 4.9 mm | - |
| Number of terminals | 8 | 8 | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | DIP | SOP | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | SMALL OUTLINE | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - |
| Maximum seat height | 4.55 mm | 1.75 mm | - |
| Maximum supply voltage (Vsup) | 12 V | 9 V | - |
| Minimum supply voltage (Vsup) | 4 V | 4 V | - |
| surface mount | NO | YES | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | GULL WING | - |
| Terminal pitch | 2.54 mm | 1.27 mm | - |
| Terminal location | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 7.62 mm | 3.9 mm | - |
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