Standard SRAM, 256KX4, 17ns, CMOS, CDIP28, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | DIP |
package instruction | 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-28 |
Contacts | 28 |
Reach Compliance Code | not_compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 17 ns |
I/O type | COMMON |
JESD-30 code | R-GDIP-T28 |
JESD-609 code | e0 |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 4 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 28 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX4 |
Output characteristics | 3-STATE |
Exportable | YES |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.4 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.01 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.145 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |