EEWORLDEEWORLDEEWORLD

Part Number

Search

W83977AF-A

Description
WINBOND I/O
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1011KB,182 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

W83977AF-A Overview

WINBOND I/O

W83977AF-A Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionPLASTIC, QFP-128
Contacts128
Reach Compliance Code_compli
Other featuresON CHIP FDC AND UART
Address bus width16
boundary scanNO
Bus compatibilityPC-XT; PC-AT; ISA; PS/2
maximum clock frequency48 MHz
External data bus width8
JESD-30 codeR-PQFP-G128
JESD-609 codee0
length20 mm
Number of I/O lines21
Number of terminals128
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFQFP
Encapsulate equivalent codeQFP128,.67X.93,20
Package shapeRECTANGULAR
Package formFLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
RAM (number of words)256
Maximum seat height3.32 mm
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1
WINBOND I/O
W83977F-A/W83977G-A
&
W83977AF-A/W83977AG-A

W83977AF-A Related Products

W83977AF-A W83977AF-P W83977AG-A W83977F-A W83977F-P W83977G-A
Description WINBOND I/O WINBOND I/O WINBOND I/O WINBOND I/O WINBOND I/O WINBOND I/O
Is it Rohs certified? incompatible incompatible conform to incompatible incompatible conform to
Parts packaging code QFP QFP QFP QFP QFP QFP
package instruction PLASTIC, QFP-128 PLASTIC, QFP-128 LEAD FREE, PLASTIC, QFP-128 PLASTIC, QFP-128 PLASTIC, QFP-128 LEAD FREE, PLASTIC, QFP-128
Contacts 128 128 128 128 128 128
Reach Compliance Code _compli _compli unknow _compli _compli unknow
Other features ON CHIP FDC AND UART ON CHIP FDC AND UART ON CHIP FDC AND UART ON CHIP FDC AND UART ON CHIP FDC AND UART ON CHIP FDC AND UART
Address bus width 16 16 16 16 16 16
boundary scan NO NO NO NO NO NO
Bus compatibility PC-XT; PC-AT; ISA; PS/2 PC-XT; PC-AT; ISA; PS/2 PC-XT; PC-AT; ISA; PS/2 PC-XT; PC-AT; ISA; PS/2 PC-XT; PC-AT; ISA; PS/2 PC-XT; PC-AT; ISA; PS/2
maximum clock frequency 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz 48 MHz
External data bus width 8 8 8 8 8 8
JESD-30 code R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
length 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
Number of I/O lines 21 21 21 21 21 21
Number of terminals 128 128 128 128 128 128
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FQFP FQFP FQFP FQFP FQFP FQFP
Encapsulate equivalent code QFP128,.67X.93,20 QFP128,.67X.93,20 QFP128,.67X.93,20 QFP128,.67X.93,20 QFP128,.67X.93,20 QFP128,.67X.93,20
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH FLATPACK, FINE PITCH
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) 256 256 256 256 256 256
Maximum seat height 3.32 mm 3.32 mm 3.32 mm 3.32 mm 3.32 mm 3.32 mm
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD
width 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm
JESD-609 code e0 e0 - e0 e0 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED -
Maker - - Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号